Browse "EE-Journal Papers(저널논문)" by Subject power integrity
Showing results 1 to 2 of 2
| Band-stop filter effect of power/ground plane on through-hole signal via in multilayer PCB Pak, JS; Aoyagi, M; Kikuchi, K; Kim, Joungho, IEICE TRANSACTIONS ON ELECTRONICS, v.E89C, pp.551 - 559, 2006-04 |
| Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs Song, Eun-Seok; Koo, Kyoung-Choul; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.9, pp.1467 - 1480, 2013-09 |
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