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Microwave frequency interconnection line model of a wafer level package Lee, J; Ryu, W; Kim, Joungho; Kim, N; Pak, J; Kim, JM, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, pp.356 - 364, 2002-08 |
Multiport measurement method using a two-port network analyzer with remaining ports unterminated Kam, Dong Gun; Kim, Joungho, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.17, no.9, pp.694 - 696, 2007-09 |
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