Showing results 1 to 1 of 1
Microwave frequency crosstalk model of redistribution line patterns on wafer level package Sung, M.; Kim, N.; Lee, J.; Kim, H.; Choi, B.K.; Kim, J.-M.; Hong, J.-K.; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, no.2, pp.265 - 271, 2002-05 |
Discover