Browse "EE-Journal Papers(저널논문)" by Subject 3-D integrated circuit (3-D IC)
Showing results 1 to 2 of 2
| Active Silicon Interposer Design for Interposer-Level Wireless Power Transfer Technology for High-Density 2.5-D and 3-D ICs Song, Jinwook; Park, Shinyoung; Kim, Sukjin; Kim, Jonghoon J.; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.8, pp.1148 - 1161, 2016-08 |
| Fast Location of Opens in TSV-Based 3-D Chip Using Simple Resistor Chain Hu, Sanming; Jin, Cheng; Li, Hongyu; Li, Rui; Chong, Ser Choong; Jong, Ming Chinq; Wai, Eva Leong Ching; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.61, no.7, pp.2584 - 2587, 2014-07 |
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