Browse "EE-Journal Papers(저널논문)" by Author Sung, M.
Showing results 1 to 2 of 2
| An efficient crosstalk parameter extraction method for high-speed interconnection lines Sung, M.; Ryu, W.; Kim, H.; Kim, J.; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.2, pp.148 - 155, 2000-05 |
| Microwave frequency crosstalk model of redistribution line patterns on wafer level package Sung, M.; Kim, N.; Lee, J.; Kim, H.; Choi, B.K.; Kim, J.-M.; Hong, J.-K.; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, no.2, pp.265 - 271, 2002-05 |
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