Browse "EE-Journal Papers(저널논문)" by Author Park, Shinyoung
Showing results 1 to 10 of 10
| A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an nth Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive WPT System Sim, Boogyo; Jeong, Seungtaek; Kim, Youngwoo; Park, Shinyoung; Lee, Seongsoo; Hong, Seokwoo; Song, Jinwook; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.63, no.3, pp.935 - 946, 2021-06 |
| Active Silicon Interposer Design for Interposer-Level Wireless Power Transfer Technology for High-Density 2.5-D and 3-D ICs Song, Jinwook; Park, Shinyoung; Kim, Sukjin; Kim, Jonghoon J.; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.8, pp.1148 - 1161, 2016-08 |
| Channel Characteristic-Based Deep Neural Network Models for Accurate Eye Diagram Estimation in High Bandwidth Memory (HBM) Silicon Interposer Lho, Daehwan; Park, Hyunwook; Park, Shinyoung; Kim, Subin; Kang, Hyungmin; Sim, Boogyo; Kim, Seongguk; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.64, no.1, pp.196 - 208, 2022-02 |
| High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package Kim, Hyesoo; Kim, Jonghoon J.; Park, Junyong; Park, Shinyoung; Choi, Sumin; Bae, Bumhee; Ha, DongHo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1356 - 1368, 2017-08 |
| Modeling, Measurement, and Analysis of Audio Frequency Ground Integrity for a TDMA Smartphone System Park, Shinyoung; Song, Jinwook; Kim, Subin; Kim, Youngwoo; Lee, Man Ho; Kim, Joungho, IEEE Transactions on Components, Packaging and Manufacturing Technology, v.8, no.4, pp.519 - 530, 2018-04 |
| Polynomial Model-Based Eye Diagram Estimation Methods for LFSR-Based Bit Streams in PRBS Test and Scrambling Park, Junyong; Park, Shinyoung; Kim, Youngwoo; Park, Gapyeol; Park, Hyunwook; Lho, Daehwan; Cho, Kyungjun; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.61, no.6, pp.1867 - 1875, 2019-12 |
| Reinforcement-Learning-Based Signal Integrity Optimization and Analysis of a Scalable 3-D X-Point Array Structure Son, Kyungjune; Kim, Minsu; Park, Hyunwook; Lho, Daehwan; Son, Keeyoung; Kim, Keunwoo; Lee, Seongsoo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.12, no.1, pp.100 - 110, 2022-01 |
| Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme Kim, Seongguk; Kim, Subin; Cho, Kyungjun; Shin, Taein; Park, Hyunwook; Lho, Daehwan; Park, Shinyoung; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.11, pp.1955 - 1970, 2021-11 |
| Signal Integrity Modeling and Analysis of Large-Scale Memristor Crossbar Array in a High-Speed Neuromorphic System for Deep Neural Network Shin, Taein; Park, Shinyoung; Kim, Seongguk; Kim, Subin; Son, Kyungjune; Park, Hyunwook; Lho, Daehwan; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.7, pp.1122 - 1136, 2021-07 |
| Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module Son, Keeyoung; Kim, Seongguk; Park, Hyunwook; Shin, Taein; Kim, Keunwoo; Kim, Minsu; Sim, Boogyo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.12, no.9, pp.1542 - 1556, 2022-09 |
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