Browse "EE-Journal Papers(저널논문)" by Author Park, HyoHoon
Showing results 1 to 60 of 62
| 10 Gbps/ch Full-Duplex Optical Link Using a Single-Fiber Channel for Signal Transmission Nga, Nguyen T. H.; Sangirov, Jamshid; Joo, Gwan-Chong; Yoo, Byueng-Su; Ukaegbu, Ikechi Augustine; Lee, Tae-Woo; Cho, Mu-Hee; et al, IEEE PHOTONICS TECHNOLOGY LETTERS, v.26, no.6, pp.609 - 612, 2014-03 |
| 2.5 Gbit/s multifunctional CMOS transceiver for chip-to-chip optical link Kang, SK; Lee, TW; Park, HyoHoon, ELECTRONICS LETTERS, v.42, no.7, pp.410 - 412, 2006-03 |
40 Gb/s optical subassembly module for a multi-channel bidirectional optical link Sangirov, Jamshid; Joo, Gwan-Chong; Choi, Jae-Shik; Kim, Do-Hoon; Yoo, Byueng-Su; Ukaegbu, Ikechi Augustine; Nga, Nguyen T. H.; et al, OPTICS EXPRESS, v.22, no.2, pp.1768 - 1783, 2014-01 |
| A fluxless flip-chip bonding for VCSEL arrays using silver-coated indium solder bumps Chu, KM; Lee, JS; Cho, HS; Park, HyoHoon; Jeon, DY, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.27, no.4, pp.246 - 253, 2004-10 |
| A novel bidirectional CMOS transceiver for chip-to-chip optical interconnects Kang, SK; Lee, TW; Plant, DV; Park, HyoHoon, IEEE PHOTONICS TECHNOLOGY LETTERS, v.18, no.1-4, pp.70 - 72, 2006-01 |
| A simple method for calculating coupling efficiency in optical interconnection system involving various misalignment parameters Cho, HS; Kim, WH; Park, HyoHoon, OPTICS AND LASERS IN ENGINEERING, v.42, no.5, pp.503 - 509, 2004-11 |
| Amorphous GaAs passivation of ion-beam-etched InGaAs vertical-cavity surface-emitting lasers Park, HyoHoon; Yoo, BS; Chu, HY; Park, MS; Lee, JJ; Lee, HG; Lee, EH; et al, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.29, no.4, pp.522 - 525, 1996-08 |
| Biwavelength transceiver module for parallel simultaneous bidirectional optical interconnections Nguyen, Nga T. H.; Ukaegbu, Ikechi A.; Sangirov, Jamshid; Cho, Mu-Hee; Lee, Tae-Woo; Park, HyoHoon, OPTICAL ENGINEERING, v.52, no.12, 2013-12 |
| Board-to-board optical interconnection system using optical slots Cho, IK; Yoon, KB; Ahn, SH; Jeong, MY; Sung, HK; Lee, BH; Heo, YU; et al, IEEE PHOTONICS TECHNOLOGY LETTERS, v.16, no.7, pp.1754 - 1756, 2004-07 |
| Characteristics of indium bump for flip-chip bonding used in polymeric-waveguide-integrated optical interconnection systems Chu, KM; Lee, JS; Cho, HS; Rho, BS; Park, HyoHoon; Jeon, DukYoung, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.43, no.8B, pp.5922 - 5927, 2004-08 |
| Chip-to-chip optical link system using an optical wiring method Cho, IK; Ahn, SH; Rho, BS; Chung, KS; Park, HyoHoon, IEEE PHOTONICS TECHNOLOGY LETTERS, v.19, no.13-16, pp.1151 - 1153, 2007-07 |
| Compact packaging of optical and electronic components for on-board optical interconnects Cho, HS; Chu, KM; Kang, S; Hwang, SH; Rho, BS; Kim, WH; Kim, JS; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.28, no.1, pp.114 - 120, 2005-02 |
| Comparison of 1545 nm pump to 1480 nm pump for high power long-wavelength-band erbium-doped fibre amplifier Choi, BH; Park, HyoHoon; Chu, MJ, ELECTRONICS LETTERS, v.39, no.13, pp.970 - 972, 2003-06 |
| EFFECT OF DIHEDRAL ANGLE ON THE MORPHOLOGY OF GRAINS IN A MATRIX PHASE Park, HyoHoon; Yoon, Duk Yong, METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.16, no.5, pp.923 - 928, 1985 |
| EFFECT OF STRESS SIGN AND FILM THICKNESS ON INTERFACE NUCLEATION OF MISFIT DISLOCATIONS IN STRAINED MULTILAYERS Park, HyoHoon; YOO, JB; OH, DK; KIM, JS; Lee, JeongYong, JOURNAL OF APPLIED PHYSICS, v.75, no.10, pp.4990 - 4993, 1994-05 |
| Evolution of the surface cross-hatch pattern in InxGa1-xAs/GaAs layers grown by metal-organic chemical vapor deposition Yoon, M; Lee, B; Baek, JH; Park, HyoHoon; Lee, EH; Lee, JeongYong, APPLIED PHYSICS LETTERS, v.68, no.1, pp.16 - 18, 1996-01 |
| Experimental demonstration of 10 Gbit/s transmission with an optical backplane system using optical slots Cho, IK; Yoon, KB; Alm, SH; Sung, HK; Ha, SW; Heo, YU; Park, HyoHoon, OPTICS LETTERS, v.30, no.13, pp.1635 - 1637, 2005-07 |
| Fabrication of fiber-embedded boards using grooving technique for optical interconnection applications Cho, HS; Kang, S; Rho, BS; Park, HyoHoon; Shin, KU; Ha, SW; Rhee, BH; et al, OPTICAL ENGINEERING, v.43, no.12, pp.3083 - 3088, 2004-12 |
| Fabrication of thermally stable and cost-effective polymeric waveguide for optical printed-circuit board Kim, Do-Won; Ahn, Seung Ho; Cho, In-Kui; Im, Dong-Min; Muslim, Shirazy Md. Shorab; Park, HyoHoon, OPTICS EXPRESS, v.16, no.21, pp.16798 - 16805, 2008-10 |
| Flip-chip bonding of MEMS scanner for laser display using electroplated AuSn solder bump Chu, KM; Choi, WK; Ko, YC; Lee, JH; Park, HyoHoon; Jeon, DukYoung, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.1, pp.27 - 33, 2007-02 |
| FORMATION OF MISFIT DISLOCATIONS DURING ZN-DIFFUSION-INDUCED INTERMIXING OF A GAINASP/INP HETEROSTRUCTURE Park, HyoHoon; NAM, ES; LEE, YT; LEE, EH; Lee, JeongYong, APPLIED PHYSICS LETTERS, v.59, no.16, pp.2025 - 2027, 1991-10 |
| High-coupling-efficiency optical interconnection using a 90(circle)-bent fiber array connector in optical printed circuit boards Cho, MH; Hwang, SH; Cho, HS; Park, HyoHoon, IEEE PHOTONICS TECHNOLOGY LETTERS, v.17, no.3, pp.690 - 692, 2005-03 |
| High-efficiency and stable optical transmitter using VCSEL-direct-bonded connector for optical interconnection Park, HyoHoon; Kim, DW; Lee, TW; Cho, MH, OPTICS EXPRESS, v.15, no.24, pp.15767 - 15775, 2007-11 |
| High-finesse AlxOy/AlGaAs nonabsorbing optical cavity Shin, HE; Ju, YG; Song, HW; Song, DS; Han, IY; Ser, JH; Ryu, HY; et al, APPLIED PHYSICS LETTERS, v.72, no.18, pp.2205 - 2207, 1998-05 |
| High-gain coefficient long-wavelength-band erbium-doped fiber amplifier using 1530-nm band pump Choi, BH; Park, HyoHoon; Chu, M; Kim, SK, IEEE PHOTONICS TECHNOLOGY LETTERS, v.13, no.2, pp.109 - 111, 2001-02 |
| High-speed subcarrier based on high-resistivity silicon for long-wavelength VCSEL array Hwang, SH; Park, HyoHoon; Choi, JH; Rho, BS, IEEE PHOTONICS TECHNOLOGY LETTERS, v.18, no.21-24, pp.2523 - 2525, 2006-11 |
| HOMOGENEOUS NUCLEATION OF MISFIT DISLOCATIONS IN STRAINED LAYERS Park, HyoHoon; Lee, JeongYong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.33, no.6A, pp.3409 - 3414, 1994-06 |
| Improving 60-GHz band radio-frequency with radio-over-fiber link characteristics of optical transmitter system-on-packaging Choi, KS; Chung, YD; Sim, JS; Moon, JT; Yu, HK; Park, HyoHoon; Kim, J, OPTICAL ENGINEERING, v.47, no.2, 2008-02 |
| IMPURITY DIFFUSION ENHANCEMENT OF INTERDIFFUSION IN AN INGAPAS-GAAS HETEROSTRUCTURE LEE, KH; Park, HyoHoon; STEVENSON, DA, JOURNAL OF APPLIED PHYSICS, v.65, no.3, pp.1048 - 1052, 1989-02 |
| Low threshold current density and high efficiency surface-emitting lasers with a periodic gain active structure Park, HyoHoon; Yoo, BS, ETRI JOURNAL, v.17, no.1, pp.1 - 10, 1995-04 |
| Low-crosstalk and high-efficiency optical interconnection using 45 degrees-ended connection rods Rho, BS; Cho, MH; Cho, HS; Kang, S; Park, HyoHoon; Ha, SW; Rhee, BH, ELECTRONICS LETTERS, v.40, no.12, pp.730 - 732, 2004-06 |
| LOW-THRESHOLD CURRENT-DENSITY INGAAS SURFACE-EMITTING LASERS WITH PERIODIC GAIN ACTIVE STRUCTURE YOO, BS; Park, HyoHoon; LEE, EH, ELECTRONICS LETTERS, v.30, no.13, pp.1060 - 1061, 1994-06 |
| Low-threshold-current and single-mode surface-emitting laser buried in amorphous GaAs Park, HyoHoon; Yoo, BS; Chu, HY; Lee, EH; Park, MS; Ahn, BT, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.35, no.2B, pp.1378 - 1381, 1996-02 |
| MICROSTRUCTURAL DEGRADATION DURING ZN DIFFUSION IN A GAINASP/INP HETEROSTRUCTURE - LAYER MIXING, MISFIT DISLOCATION GENERATION, AND ZN3P2 PRECIPITATION Park, HyoHoon; LEE, KH; Lee, JeongYong; LEE, YT; LEE, EH; LEE, JY; HONG, SK; et al, JOURNAL OF APPLIED PHYSICS, v.72, no.9, pp.4063 - 4072, 1992-11 |
| Multichip optical transmitter module for chip-to-chip interconnection on optical PCBs Kang, SK; Lee, TW; Hwang, SH; Cho, MH; Park, HyoHoon, ELECTRONICS LETTERS, v.42, no.14, pp.805 - 806, 2006-07 |
| Multigigabit CMOS limiting amplifier and VCSEL driver arrays for parallel optical interconnects Kang, SK; Lee, TW; Park, HyoHoon, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.48, no.8, pp.1656 - 1659, 2006-08 |
| New pump wavelength of 1540-nm band for long-wavelength-band erbium-doped fiber amplifier (L-band EDFA) Choi, BH; Park, HyoHoon; Chu, MJ, IEEE JOURNAL OF QUANTUM ELECTRONICS, v.39, no.10, pp.1272 - 1280, 2003-10 |
| Optical backplane system using waveguide-embedded PCBs and optical slots Yoon, KB; Cho, IK; Ahn, SH; Jeong, NY; Lee, DJ; Heo, YU; Rho, BS; et al, JOURNAL OF LIGHTWAVE TECHNOLOGY, v.22, no.9, pp.2119 - 2127, 2004-09 |
| Optical Chip-to-Chip Link System by Using Optical Wiring Method for Reducing EMI Cho, In-Kui; Yun, Jae-Hoon; Jeong, Myung-Yung; Park, HyoHoon, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, no.3, pp.722 - 728, 2010-08 |
| Optical interconnection platform composed of fiber-embedded board, 90 degrees-bent fiber block, and 10-Gb/s optical module Hwang, SH; Cho, MH; Kang, SK; Cho, HS; Lee, TW; Park, HyoHoon, JOURNAL OF LIGHTWAVE TECHNOLOGY, v.26, no.9-12, pp.1479 - 1485, 2008-05 |
| Optical interconnection using fiber-embedded boards and connection blocks fabricated by a micro-grooving technique for fiber insertion Cho, HS; Kang, S; Cho, MH; Rho, BS; Park, HyoHoon; Shin, KU; Ha, SW; et al, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.14, no.8, pp.1181 - 1184, 2004-08 |
| Optical module using polymer waveguide with integrated reflector mirrors Cho, IK; Lee, WJ; Jeong, MY; Park, HyoHoon, IEEE PHOTONICS TECHNOLOGY LETTERS, v.20, no.5-8, pp.410 - 412, 2008-03 |
| Optoelectronic and microwave characteristics of silver coated indium bumps for low temperature flip-chip applications Chu, KM; Choi, JH; Lee, JS; Cho, HS; Park, SeongOok; Park, HyoHoon; Jeon, DukYoung, ELECTRONICS LETTERS, v.40, no.23, pp.1508 - 1509, 2004-11 |
| Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications Chu, K.-M.; Choi, J.-H.; Lee, J.-S.; Cho, H.S.; Park, SeongOok; Park, HyoHoon; Jeon, D.Y., IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.29, no.3, pp.409 - 414, 2006-08 |
| Parallel optical transmitter module using angled fibers and a V-grooved silicon optical bench for VCSEL array Hwang, Sung Hwan; Seo, Dae Dong; An, Jae Yong; Kim, Myeong-Hyun; Choi, Woo Chang; Cho, Sung Ryul; Lee, Sang Hwan; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.29, no.3, pp.457 - 462, 2006-08 |
| Passively assembled optical inter-connection system based on an optical printed-circuit board Hwang, SH; Cho, MH; Kang, SK; Park, HyoHoon; Cho, HS; Kim, SH; Shin, KU; et al, IEEE PHOTONICS TECHNOLOGY LETTERS, v.18, no.5-8, pp.652 - 654, 2006-03 |
| PCB-compatible optical interconnection using 45 degrees-ended connection rods and via-holed waveguides Rho, BS; Kang, S; Cho, HS; Park, HyoHoon; Ha, SW; Rhee, BH, JOURNAL OF LIGHTWAVE TECHNOLOGY, v.22, no.9, pp.2128 - 2134, 2004-09 |
| Performances of erbium-doped fiber amplifier using 1530nm-band pump for long wavelength multichannel amplification Choi, BH; Chu, MJ; Park, HyoHoon; Lee, JH, ETRI JOURNAL, v.23, no.1, pp.1 - 8, 2001-03 |
| Polarization characteristics of index-guided surface-emitting lasers with tilted pillar structure Chu, HY; Yoo, BS; Park, MS; Park, HyoHoon, IEEE PHOTONICS TECHNOLOGY LETTERS, v.9, no.8, pp.1066 - 1068, 1997 |
| Polarization control of vertical-cavity surface-emitting lasers by electro-optic birefringence Park, MS; Ahn, Byung Tae; Yoo, BS; Chu, HY; Park, HyoHoon; Chang-Hasnain, CJ, APPLIED PHYSICS LETTERS, v.76, no.7, pp.813 - 815, 2000-02 |
| PORE FILLING PROCESS IN LIQUID-PHASE SINTERING Park, HyoHoon; CHO, SJ; Yoon, Duk Yong, METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.15, no.6, pp.1075 - 1080, 1984 |
| Power-aware transceiver design for half-duplex bidirectional chip-to-chip optical interconnects Sangirov, Jamshid; A. Ukaegbu, I.; Sangirov, G.; Lee, Tae Woo; Park, HyoHoon, JOURNAL OF SEMICONDUCTORS, v.34, no.12, pp. -, 2013-12 |
| PRECISE NONSELECTIVE CHEMICALLY ASSISTED ION-BEAM ETCHING OF ALGAAS GAAS BRAGG REFLECTORS BY IN-SITU LASER REFLECTOMETRY YOO, JY; SHIN, JH; Lee, Yong-Hee; Park, HyoHoon; YOO, BS, OPTICAL AND QUANTUM ELECTRONICS, v.27, no.5, pp.421 - 425, 1995-05 |
| Stable transverse mode emission in vertical-cavity surface-emitting lasers antiguided by amorphous GaAs layer Yoo, BS; Chu, HY; Park, MS; Park, HyoHoon; Lee, EH, ELECTRONICS LETTERS, v.32, no.2, pp.116 - 117, 1996-01 |
| Surface morphology of InGaAs on GaAs(100) by chemical beam epitaxy using unprecracked monoethylarsine, triethylgallium and trimethylindium Park, SJ; Ro, JR; Ha, JS; Kim, SB; Park, HyoHoon; Lee, EH; Yi, JY; et al, SURFACE SCIENCE, v.350, no.1-3, pp.221 - 228, 1996-04 |
| System-on-packaging with electroabsorption modulator for a 60-GHz band radio-over-fiber link Choi, KS; Chung, YD; Jun, DS; Moon, JT; Kim, J; Yu, HK; Park, HyoHoon, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.31, no.1, pp.163 - 169, 2008-02 |
| THE CRITICAL GRAIN-SIZE FOR LIQUID FLOW INTO PORES DURING LIQUID-PHASE SINTERING Park, HyoHoon; KWON, OJ; Yoon, Duk Yong, METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.17, pp.1915 - 1919, 1986-11 |
| Thermal and chemical stability of reflowed-photoresist microlenses Han, MG; Park, YJ; Kim, SH; Yoo, BS; Park, HyoHoon, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.14, no.3, pp.398 - 402, 2004-03 |
| Transverse mode characteristics of vertical-cavity surface-emitting lasers buried in amorphous GaAs antiguide layer Yoo, BS; Chu, HY; Park, HyoHoon; Lee, HG; Lee, JJ, IEEE JOURNAL OF QUANTUM ELECTRONICS, v.33, no.10, pp.1794 - 1800, 1997 |
| Two-dimensional optical interconnection based on two-layered optical printed circuit board Hwang, SH; Cho, MH; Kang, SK; Lee, TW; Park, HyoHoon; Rho, BU, IEEE PHOTONICS TECHNOLOGY LETTERS, v.19, no.5-8, pp.411 - 413, 2007-03 |
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