Browse "EE-Journal Papers(저널논문)" by Author Paek, Ji-Seon
Showing results 1 to 9 of 9
| A 1.83 GHz 28.5 dBm CMOS Power Up-Mixer Paek, Ji-Seon; Hong, Song-Cheol, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.19, no.6, pp.389 - 391, 2009-06 |
| A 29 dBm 70.7% PAE Injection-Locked CMOS Power Amplifier for PWM Digitized Polar Transmitter Paek, Ji-Seon; Hong, Song-Cheol, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.20, no.11, pp.637 - 639, 2010-11 |
| A Fully Integrated Multi-Phase Buck Converter With On-Chip Capacitor Dynamic Re-Allocation and Fine-Grained Phase-Shedding Techniques Cho, Jeong-Hyun; Kim, Dong-Kyu; Bae, Hong-Hyun; Lee, Yong-Jin; Koh, Seok-Tae; Choo, Younghwan; Paek, Ji-Seon; et al, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.57, no.12, pp.3840 - 3852, 2022-12 |
| Analysis and Design of CMOS Amplitude Modulator With Digitally Controlled Variable Attenuator Paek, Ji-Seon; Lee, Hyun-Yong; Hong, Song-Cheol, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.59, no.3, pp.727 - 740, 2011-03 |
| CMOS LNA with Darlington-pair for UWB systems Paek, Ji-Seon; Park, B; Hong, Song-Cheol, ELECTRONICS LETTERS, v.42, no.16, pp.913 - 915, 2006-08 |
| Delta Sigma digitised polar transmitter with CMOS switching power amplifier Paek, Ji-Seon; Lee, H. -Y.; Joo, T. H.; Hong, Song-Cheol, ELECTRONICS LETTERS, v.46, no.23, pp.1551 - 1552, 2010-11 |
| Envelope Modulator for 1.5-W 10-MHz LTE PA Without AC Coupling Capacitor Achieving 86.5% Peak Efficiency Sung, Si Duk; Hong, Sung-Wan; Bang, Jun-Suk; Paek, Ji-Seon; Lee, Seung-Chul; Cho, Thomas Byung-Hak; Cho, Gyu-Hyeong, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.31, no.12, pp.8282 - 8292, 2016-12 |
| Low-power CMOS polar modulator for multiband and multimode RF transmitter Paek, Ji-Seon; Lee, H. -Y.; Hong, Song-Cheol, ELECTRONICS LETTERS, v.46, no.14, pp.1032 - 1033, 2010-07 |
| Millimeter-Wave Frequency Reconfigurable Dual-Band CMOS Power Amplifier for 5G Communication Radios Lee, Jaehun; Paek, Ji-Seon; Hong, Songcheol, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.70, no.1, pp.801 - 812, 2022-01 |
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