Browse "EE-Journal Papers(저널논문)" by Author Oh, T
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| Suppression of power/ground inductive impedance and simultaneous switching noise using silicon through-via in a 3-D stacked chip package Ryu, C; Park, J; Pak, JS; Lee, K; Oh, T; Kim, Joungho, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.17, pp.855 - 857, 2007-12 |
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