Browse "EE-Journal Papers(저널논문)" by Author Oh, Sangmook
Showing results 1 to 1 of 1
| Fast and Accurate Power Distribution Network Modeling of a Silicon Interposer for 2.5-D/3-D ICs With Multiarray TSVs Cho, Kyungjun; Kim, Youngwoo; Kim, Subin; Park, Hyunwook; Park, Junyong; Lee, Seongsoo; Shim, Daeyong; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.9, pp.1835 - 1846, 2019-09 |
Discover
Open Access
- 573 OA Article
Date issued
- 1,794 2020 - 2024
- 5,084 2010 - 2019
- 4,213 2000 - 2009
- 2,379 1990 - 1999
- 665 1980 - 1989