Browse "EE-Journal Papers(저널논문)" by Author Lee H.
Showing results 1 to 3 of 3
| Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole Lee H.; Hong Y.-S.; Kam D.G.; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.28, no.2, pp.168 - 173, 2005 |
| Effects on signal integrity and radiated emission by split reference plane on high-speed multilayer printed circuit boards Kim, Joungho; Lee H., IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.28, no.4, pp.724 - 735, 2005-11 |
| Twisted differential line structure on high-speed printed circuit boards to reduce crosstalk and radiated emission Kam D.G.; Lee H.; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.27, no.4, pp.590 - 596, 2004-11 |
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