Browse "EE-Journal Papers(저널논문)" by Author Lee, J.-S.

Showing results 1 to 1 of 1

1
Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications

Chu, K.-M.; Choi, J.-H.; Lee, J.-S.; Cho, H.S.; Park, SeongOok; Park, HyoHoon; Jeon, D.Y., IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.29, no.3, pp.409 - 414, 2006-08

Discover

Type

Open Access

Date issued

. next

Subject

. next

rss_1.0 rss_2.0 atom_1.0