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Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory) Kim, Dae Hyun; Athikulwongse, Krit; Healy, Michael B.; Hossain, Mohammad M.; Jung, Moongon; Khorosh, Ilya; Kumar, Gokul; et al, IEEE TRANSACTIONS ON COMPUTERS, v.64, no.1, pp.112 - 125, 2015-01 |
Design and Demonstration of Power Delivery Networks With Effective Resonance Suppression in Double-Sided 3-D Glass Interposer Packages Kumar, Gokul; Sitaraman, Srikrishna; Cho, Jonghyun; Sundaram, Venky; Kim, Joungho; Tummala, Rao R, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.1, pp.87 - 99, 2016-01 |
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