Browse "EE-Journal Papers(저널논문)" by Author Jeon, DY
Showing results 1 to 1 of 1
| A fluxless flip-chip bonding for VCSEL arrays using silver-coated indium solder bumps Chu, KM; Lee, JS; Cho, HS; Park, HyoHoon; Jeon, DY, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.27, no.4, pp.246 - 253, 2004-10 |
Discover
Open Access
- 573 OA Article
Date issued
- 1,908 2020 - 2024
- 5,085 2010 - 2019
- 4,213 2000 - 2009
- 2,379 1990 - 1999
- 665 1980 - 1989