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Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs With Via Arrays Kim, Jingook; Shringarpure, Ketan; Fan, Jun; Kim, Joungho; Drewniak, James L., IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.21, no.2, pp.62 - 64, 2011-02 |
Inductance Calculations for Plane-Pair Area Fills With Vias in a Power Distribution Network Using a Cavity Model and Partial Inductances Kim, Jingook; Fan, Jun; Ruehli, Albert E.; Kim, Joungho; Drewniak, James L., IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.59, no.8, pp.1909 - 1924, 2011-08 |
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