Browse "EE-Journal Papers(저널논문)" by Author Chun, Jong-Hoon
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| A 3-D X-Band T/R Module Package With an Anodized Aluminum Multilayer Substrate for Phased Array Radar Applications Yeo, Sung-Ku; Chun, Jong-Hoon; Kwon, Young Se, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, no.4, pp.883 - 891, 2010-11 |
| Quasi-Coaxial Vertical via Transitions for 3-D Packages Using Anodized Aluminum Substrates Yeo, Sung-Ku; Kim, Kyoung-Min; Chun, Jong-Hoon; Kwon, Young Se, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.19, no.6, pp.365 - 367, 2009 |
| X-BAND HIGH-POWER AMPLIFIER WITH A MAGNETICALLY COUPLED POWER-COMBINER Lee, Kyung-Ai; Park, Changkun; Chun, Jong-Hoon; Hong, Songcheol, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.52, no.1, pp.110 - 113, 2010-01 |
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