Browse "EE-Journal Papers(저널논문)" by Author Chu, KM
Showing results 1 to 5 of 5
| A fluxless flip-chip bonding for VCSEL arrays using silver-coated indium solder bumps Chu, KM; Lee, JS; Cho, HS; Park, HyoHoon; Jeon, DY, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.27, no.4, pp.246 - 253, 2004-10 |
| Characteristics of indium bump for flip-chip bonding used in polymeric-waveguide-integrated optical interconnection systems Chu, KM; Lee, JS; Cho, HS; Rho, BS; Park, HyoHoon; Jeon, DukYoung, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.43, no.8B, pp.5922 - 5927, 2004-08 |
| Compact packaging of optical and electronic components for on-board optical interconnects Cho, HS; Chu, KM; Kang, S; Hwang, SH; Rho, BS; Kim, WH; Kim, JS; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.28, no.1, pp.114 - 120, 2005-02 |
| Flip-chip bonding of MEMS scanner for laser display using electroplated AuSn solder bump Chu, KM; Choi, WK; Ko, YC; Lee, JH; Park, HyoHoon; Jeon, DukYoung, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.1, pp.27 - 33, 2007-02 |
| Optoelectronic and microwave characteristics of silver coated indium bumps for low temperature flip-chip applications Chu, KM; Choi, JH; Lee, JS; Cho, HS; Park, SeongOok; Park, HyoHoon; Jeon, DukYoung, ELECTRONICS LETTERS, v.40, no.23, pp.1508 - 1509, 2004-11 |
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