Browse "EE-Journal Papers(저널논문)" by Author Bravman, JC
Showing results 1 to 4 of 4
| A high-voltage scanning electron microscopy system for in situ electromigration testing Doan, JC; Lee, S; Lee, Seok-Hee; Meier, NE; Bravman, JC; Flinn, PA; Marieb, TN; et al, REVIEW OF SCIENTIFIC INSTRUMENTS, v.71, no.7, pp.2848 - 2854, 2000-07 |
| An analysis technique for extraction of thin film stresses from x-ray data Cornella, G; Lee, Seok-Hee; Nix, WD; Bravman, JC, APPLIED PHYSICS LETTERS, v.71, no.20, pp.2949 - 2951, 1997-11 |
| Stress-induced and electromigration voiding in aluminum interconnects passivated with silicon nitride Lee, Seok-Hee; Bravman, JC; Doan, JC; Lee, S; Flinn, PA; Marieb, TN, JOURNAL OF APPLIED PHYSICS, v.91, no.6, pp.3653 - 3657, 2002-03 |
| Void nucleation on intentionally added defects in Al interconnects Doan, JC; Lee, Seok-Hee; Bravman, JC; Flinn, PA; Marieb, TN, APPLIED PHYSICS LETTERS, v.75, no.5, pp.633 - 635, 1999-08 |
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