Browse "EE-Journal Papers(저널논문)" by Author Bae, Hyun-Cheol
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| Measurement and Analysis of a High-Speed TSV Channel Kim, Hee-Gon; Cho, Jong-Hyun; Kim, Myung-Hoi; Kim, Ki-Yeong; Lee, Jun-Ho; Lee, Hyung-Dong; Park, Kun-Woo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.10, pp.1672 - 1685, 2012-10 |
| Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis Jung, Daniel Hyunsuk; Kim, Youngwoo; Kim, Jonghoon J.; Kim, Heegon; Choi, Sumin; Song, Yoon-Ho; Bae, Hyun-Cheol; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.1, pp.138 - 152, 2017-01 |
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