Showing results 1 to 4 of 4
3-D construction of monolithic passive components for RF and microwave ICs using thick-metal surface micromachining technology Yoon, Jun-Bo; Kim, BI; Choi, YS; Yoon, E, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.51, no.1, pp.279 - 288, 2003-01 |
CMOS-compatible surface-micromachined suspended-spiral inductors for multi-GHz silicon RF ICs Yoon, Jun-Bo; Choi, YS; Kim, BI; Eo, Y; Yoon, E, IEEE ELECTRON DEVICE LETTERS, v.23, no.10, pp.591 - 593, 2002-10 |
Dry release for surface micromachining with HF vapor-phase etching Lee, Yong-Il; Park, Kyung-Ho; Lee, Jong Hyun; Lee, Chun Su; Yoo, Hyung Joun; Kim, Chang-Jin; Yoon, Yong-San, JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, v.6, no.3, pp.226 - 233, 1997-09 |
Ku-band stop filter implemented on a high resistivity silicon with inverted microstrip line photonic bandgap (PBG) structure Ha, ML; Kwon, Young Se, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.15, no.6, pp.410 - 412, 2005 |
Discover