Showing results 14 to 15 of 15
Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module Son, Keeyoung; Kim, Seongguk; Park, Hyunwook; Shin, Taein; Kim, Keunwoo; Kim, Minsu; Sim, Boogyo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.12, no.9, pp.1542 - 1556, 2022-09 |
Understanding the Implication of Non-Volatile Memory for Large-Scale Graph Neural Network Training Lee, Yunjae; Kwon, Youngeun; Rhu, Minsoo, IEEE COMPUTER ARCHITECTURE LETTERS, v.20, no.2, pp.118 - 121, 2021-07 |
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