Browse "EE-Journal Papers(저널논문)" by Subject 3-D integration
Showing results 4 to 5 of 5
| Three-Dimensional Integration Approach to High-Density Memory Devices Kim, Hojung; Jeon, Sanghun; Lee, Myoung-Jae; Park, Jaechul; Kang, Sangbeom; Choi, Hyun-Sik; Park, Churoo; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.58, no.11, pp.3820 - 3828, 2011-11 |
| Vertical InGaAs Biristor for Sub-1 V Operation Kim, Wu-Kang; Bidenko, Pavlo; Kim, Jongmin; Sim, Jaeho; Han, Joon-Kyu; Kim, Seongkwang; Geum, Dae-Myeong; et al, IEEE ELECTRON DEVICE LETTERS, v.42, no.5, pp.681 - 683, 2021-05 |
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