Showing results 4 to 7 of 7
Metal-containing thin-film encapsulation with flexibility and heat transfer Kwon, Jung-Hyun; Kim, Eung Taek; Im, Hyeon-Gyun; Bae, Byeong-Soo; Chang, Ki Soo; Park, Sang-Hee Ko; Choi, Kyung Cheol, JOURNAL OF INFORMATION DISPLAY, v.16, no.2, pp.123 - 128, 2015-06 |
Reliability improvement of a flexible FD-SOI MOSFET via heat management Bong, Jae Hoon; Kim, Seung-Yoon; Jeong, Chan Bae; Chang, Ki Soo; Hwang, Wan Sik; Cho, Byung Jin, APPLIED PHYSICS LETTERS, v.110, no.25, 2017-06 |
Sanitization of Data in Nanoscale Flash Memory by Thermal Erasing and Reuse of Storage Park, Jun-Young; Moon, Dong-Il; Kim, Seong-Yeon; Im, Hwon; Chang, Ki Soo; Jeong, Chanbae; Choi, Yang-Kyu, PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, v.215, no.14, 2018-07 |
Wafer-scale, highly uniform, and well-arrayed suspended nanostructures for enhancing the performance of electronic devices Zhao, Zhi-Jun; Ahn, Junseong; Lee, Dongheon; Jeong, Chan Bae; Kang, Mingu; Choi, Jungrak; Bok, Moonjeong; et al, NANOSCALE, v.14, no.4, pp.1136 - 1143, 2022-01 |
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