Showing results 30 to 62 of 62
Low threshold current density and high efficiency surface-emitting lasers with a periodic gain active structure Park, HyoHoon; Yoo, BS, ETRI JOURNAL, v.17, no.1, pp.1 - 10, 1995-04 |
Low-crosstalk and high-efficiency optical interconnection using 45 degrees-ended connection rods Rho, BS; Cho, MH; Cho, HS; Kang, S; Park, HyoHoon; Ha, SW; Rhee, BH, ELECTRONICS LETTERS, v.40, no.12, pp.730 - 732, 2004-06 |
LOW-THRESHOLD CURRENT-DENSITY INGAAS SURFACE-EMITTING LASERS WITH PERIODIC GAIN ACTIVE STRUCTURE YOO, BS; Park, HyoHoon; LEE, EH, ELECTRONICS LETTERS, v.30, no.13, pp.1060 - 1061, 1994-06 |
Low-threshold-current and single-mode surface-emitting laser buried in amorphous GaAs Park, HyoHoon; Yoo, BS; Chu, HY; Lee, EH; Park, MS; Ahn, BT, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.35, no.2B, pp.1378 - 1381, 1996-02 |
MICROSTRUCTURAL DEGRADATION DURING ZN DIFFUSION IN A GAINASP/INP HETEROSTRUCTURE - LAYER MIXING, MISFIT DISLOCATION GENERATION, AND ZN3P2 PRECIPITATION Park, HyoHoon; LEE, KH; Lee, JeongYong; LEE, YT; LEE, EH; LEE, JY; HONG, SK; et al, JOURNAL OF APPLIED PHYSICS, v.72, no.9, pp.4063 - 4072, 1992-11 |
Multichip optical transmitter module for chip-to-chip interconnection on optical PCBs Kang, SK; Lee, TW; Hwang, SH; Cho, MH; Park, HyoHoon, ELECTRONICS LETTERS, v.42, no.14, pp.805 - 806, 2006-07 |
Multigigabit CMOS limiting amplifier and VCSEL driver arrays for parallel optical interconnects Kang, SK; Lee, TW; Park, HyoHoon, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.48, no.8, pp.1656 - 1659, 2006-08 |
New pump wavelength of 1540-nm band for long-wavelength-band erbium-doped fiber amplifier (L-band EDFA) Choi, BH; Park, HyoHoon; Chu, MJ, IEEE JOURNAL OF QUANTUM ELECTRONICS, v.39, no.10, pp.1272 - 1280, 2003-10 |
Optical backplane system using waveguide-embedded PCBs and optical slots Yoon, KB; Cho, IK; Ahn, SH; Jeong, NY; Lee, DJ; Heo, YU; Rho, BS; et al, JOURNAL OF LIGHTWAVE TECHNOLOGY, v.22, no.9, pp.2119 - 2127, 2004-09 |
Optical Chip-to-Chip Link System by Using Optical Wiring Method for Reducing EMI Cho, In-Kui; Yun, Jae-Hoon; Jeong, Myung-Yung; Park, HyoHoon, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, no.3, pp.722 - 728, 2010-08 |
Optical interconnection platform composed of fiber-embedded board, 90 degrees-bent fiber block, and 10-Gb/s optical module Hwang, SH; Cho, MH; Kang, SK; Cho, HS; Lee, TW; Park, HyoHoon, JOURNAL OF LIGHTWAVE TECHNOLOGY, v.26, no.9-12, pp.1479 - 1485, 2008-05 |
Optical interconnection using fiber-embedded boards and connection blocks fabricated by a micro-grooving technique for fiber insertion Cho, HS; Kang, S; Cho, MH; Rho, BS; Park, HyoHoon; Shin, KU; Ha, SW; et al, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.14, no.8, pp.1181 - 1184, 2004-08 |
Optical module using polymer waveguide with integrated reflector mirrors Cho, IK; Lee, WJ; Jeong, MY; Park, HyoHoon, IEEE PHOTONICS TECHNOLOGY LETTERS, v.20, no.5-8, pp.410 - 412, 2008-03 |
Optoelectronic and microwave characteristics of silver coated indium bumps for low temperature flip-chip applications Chu, KM; Choi, JH; Lee, JS; Cho, HS; Park, SeongOok; Park, HyoHoon; Jeon, DukYoung, ELECTRONICS LETTERS, v.40, no.23, pp.1508 - 1509, 2004-11 |
Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications Chu, K.-M.; Choi, J.-H.; Lee, J.-S.; Cho, H.S.; Park, SeongOok; Park, HyoHoon; Jeon, D.Y., IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.29, no.3, pp.409 - 414, 2006-08 |
Parallel optical transmitter module using angled fibers and a V-grooved silicon optical bench for VCSEL array Hwang, Sung Hwan; Seo, Dae Dong; An, Jae Yong; Kim, Myeong-Hyun; Choi, Woo Chang; Cho, Sung Ryul; Lee, Sang Hwan; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.29, no.3, pp.457 - 462, 2006-08 |
Passively assembled optical inter-connection system based on an optical printed-circuit board Hwang, SH; Cho, MH; Kang, SK; Park, HyoHoon; Cho, HS; Kim, SH; Shin, KU; et al, IEEE PHOTONICS TECHNOLOGY LETTERS, v.18, no.5-8, pp.652 - 654, 2006-03 |
PCB-compatible optical interconnection using 45 degrees-ended connection rods and via-holed waveguides Rho, BS; Kang, S; Cho, HS; Park, HyoHoon; Ha, SW; Rhee, BH, JOURNAL OF LIGHTWAVE TECHNOLOGY, v.22, no.9, pp.2128 - 2134, 2004-09 |
Performances of erbium-doped fiber amplifier using 1530nm-band pump for long wavelength multichannel amplification Choi, BH; Chu, MJ; Park, HyoHoon; Lee, JH, ETRI JOURNAL, v.23, no.1, pp.1 - 8, 2001-03 |
Polarization characteristics of index-guided surface-emitting lasers with tilted pillar structure Chu, HY; Yoo, BS; Park, MS; Park, HyoHoon, IEEE PHOTONICS TECHNOLOGY LETTERS, v.9, no.8, pp.1066 - 1068, 1997 |
Polarization control of vertical-cavity surface-emitting lasers by electro-optic birefringence Park, MS; Ahn, Byung Tae; Yoo, BS; Chu, HY; Park, HyoHoon; Chang-Hasnain, CJ, APPLIED PHYSICS LETTERS, v.76, no.7, pp.813 - 815, 2000-02 |
PORE FILLING PROCESS IN LIQUID-PHASE SINTERING Park, HyoHoon; CHO, SJ; Yoon, Duk Yong, METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.15, no.6, pp.1075 - 1080, 1984 |
Power-aware transceiver design for half-duplex bidirectional chip-to-chip optical interconnects Sangirov, Jamshid; A. Ukaegbu, I.; Sangirov, G.; Lee, Tae Woo; Park, HyoHoon, JOURNAL OF SEMICONDUCTORS, v.34, no.12, pp. -, 2013-12 |
PRECISE NONSELECTIVE CHEMICALLY ASSISTED ION-BEAM ETCHING OF ALGAAS GAAS BRAGG REFLECTORS BY IN-SITU LASER REFLECTOMETRY YOO, JY; SHIN, JH; Lee, Yong-Hee; Park, HyoHoon; YOO, BS, OPTICAL AND QUANTUM ELECTRONICS, v.27, no.5, pp.421 - 425, 1995-05 |
Stable transverse mode emission in vertical-cavity surface-emitting lasers antiguided by amorphous GaAs layer Yoo, BS; Chu, HY; Park, MS; Park, HyoHoon; Lee, EH, ELECTRONICS LETTERS, v.32, no.2, pp.116 - 117, 1996-01 |
Surface morphology of InGaAs on GaAs(100) by chemical beam epitaxy using unprecracked monoethylarsine, triethylgallium and trimethylindium Park, SJ; Ro, JR; Ha, JS; Kim, SB; Park, HyoHoon; Lee, EH; Yi, JY; et al, SURFACE SCIENCE, v.350, no.1-3, pp.221 - 228, 1996-04 |
System-on-packaging with electroabsorption modulator for a 60-GHz band radio-over-fiber link Choi, KS; Chung, YD; Jun, DS; Moon, JT; Kim, J; Yu, HK; Park, HyoHoon, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.31, no.1, pp.163 - 169, 2008-02 |
THE CRITICAL GRAIN-SIZE FOR LIQUID FLOW INTO PORES DURING LIQUID-PHASE SINTERING Park, HyoHoon; KWON, OJ; Yoon, Duk Yong, METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.17, pp.1915 - 1919, 1986-11 |
Thermal and chemical stability of reflowed-photoresist microlenses Han, MG; Park, YJ; Kim, SH; Yoo, BS; Park, HyoHoon, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.14, no.3, pp.398 - 402, 2004-03 |
Transverse mode characteristics of vertical-cavity surface-emitting lasers buried in amorphous GaAs antiguide layer Yoo, BS; Chu, HY; Park, HyoHoon; Lee, HG; Lee, JJ, IEEE JOURNAL OF QUANTUM ELECTRONICS, v.33, no.10, pp.1794 - 1800, 1997 |
Two-dimensional optical interconnection based on two-layered optical printed circuit board Hwang, SH; Cho, MH; Kang, SK; Lee, TW; Park, HyoHoon; Rho, BU, IEEE PHOTONICS TECHNOLOGY LETTERS, v.19, no.5-8, pp.411 - 413, 2007-03 |
VCSEL array module using (111) facet mirrors of a v-gooved silicon optical bench and angled fibers Hwang, SH; An, JY; Kim, MH; Choi, WC; Cho, SR; Lee, SH; Cho, HS; et al, IEEE PHOTONICS TECHNOLOGY LETTERS, v.17, no.2, pp.477 - 479, 2005-02 |
ZN DIFFUSION ENHANCEMENT OF INTERDIFFUSION IN A GAINASP-INP HETEROSTRUCTURE Park, HyoHoon; KANG, BK; NAM, ES; LEE, YT; KIM, JH; KWON, O, APPLIED PHYSICS LETTERS, v.55, no.17, pp.1768 - 1770, 1989-10 |
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