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Browse "EE-Journal Papers(저널논문)" by Author Chang, Ki Soo

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Showing results 1 to 7 of 7

1	Functional Design of Dielectric-Metal-Dielectric-Based Thin-Film Encapsulation with Heat Transfer and Flexibility for Flexible Displays Kwon, Jeong Hyun; Choi, Seungyeop; Jeon, Yongmin; Kim, Hyuncheol; Chang, Ki Soo; Choi, Kyung Cheol, ACS APPLIED MATERIALS & INTERFACES, v.9, no.32, pp.27062 - 27072, 2017-08
2	Influence of Self-Heating Effect on Interface Trap Generation in Highly Flexible Single-Crystalline Si Nanomembrane Transistors Bong, Jae Hoon; Kim, Seung-Yoon; Jeong, Chan Bae; Chang, Ki Soo; Hwang, Wan Sik; Cho, Byung Jin, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.19, no.10, pp.6481 - 6486, 2019-10
3	Investigation of Self-Heating Effects in Gate-All-Around MOSFETs With Vertically Stacked Multiple Silicon Nanowire Channels Park, Jun-Young; Lee, Byung-Hyun; Chang, Ki Soo; Kim, Dong Uk; Jeong, Chanbae; Kim, Choong-Ki; Bae, Hagyoul; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.64, no.11, pp.4393 - 4399, 2017-11
4	Metal-containing thin-film encapsulation with flexibility and heat transfer Kwon, Jung-Hyun; Kim, Eung Taek; Im, Hyeon-Gyun; Bae, Byeong-Soo; Chang, Ki Soo; Park, Sang-Hee Ko; Choi, Kyung Cheol, JOURNAL OF INFORMATION DISPLAY, v.16, no.2, pp.123 - 128, 2015-06
5	Reliability improvement of a flexible FD-SOI MOSFET via heat management Bong, Jae Hoon; Kim, Seung-Yoon; Jeong, Chan Bae; Chang, Ki Soo; Hwang, Wan Sik; Cho, Byung Jin, APPLIED PHYSICS LETTERS, v.110, no.25, 2017-06
6	Sanitization of Data in Nanoscale Flash Memory by Thermal Erasing and Reuse of Storage Park, Jun-Young; Moon, Dong-Il; Kim, Seong-Yeon; Im, Hwon; Chang, Ki Soo; Jeong, Chanbae; Choi, Yang-Kyu, PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, v.215, no.14, 2018-07
7	Wafer-scale, highly uniform, and well-arrayed suspended nanostructures for enhancing the performance of electronic devices Zhao, Zhi-Jun; Ahn, Junseong; Lee, Dongheon; Jeong, Chan Bae; Kang, Mingu; Choi, Jungrak; Bok, Moonjeong; et al, NANOSCALE, v.14, no.4, pp.1136 - 1143, 2022-01

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