Search
Results 1-10 of 28 (Search time: 0.004 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Power and Signal Integrity Analysis of Fan-out Wafer Level Package for Mobile Application Processor Kim, Joungho; Kim, Youngwoo; Cho, Kyungjun; Park, Gapyeol; Kim, Subin; Kang, Kibum; So, Kwangsup; Jeon, Jiwon; Kim, Chungju; Paik, Woohyun, DesignCon 2017, DesignCon 2017, 2017-01-31 | |
| Modeling, Measurement, and Analysis of TSV Channel and Defects for 2.5D/3D IC Failure Analysis Kim, Joungho; Jung, Daniel H; Bae, Hyun-Cheol; Choi, Kwang-Seong; Youn, Joong Suk, DesignCon 2017, DesignCon 2017, 2017-02-01 | |
| Magnetically-Coupled Current Probing Structures and Method for Reconstruction of Switching Current Kim, Joungho; Kim, Jonghoon J.; Kim, Heegon; Cho, Chang Hyun, DesignCon 2017, DesignCon 2017, 2017-02-01 | |
| Design and analysis of high bandwidth memory (HBM) interposer Considering Signal and Power integirty (SI/PI) for terabyte/s bandwidth system Kim, Joungho; Cho, Kyungjun; Lee, Hyunsuk; Kim, Heegon; Kim, Youngwoo; Choi, Sumin; Kim, Subin; Kim, Hyungsoo, DesignCon 2017, DesignCon 2017, 2017-02-01 | |
| Crosstalk Effects on Eye-Diagram and BER for High-Bandwidth Memory Channel Kim, Joungho; Choi, Sumin; Kim, Heegon; Kim, Kiyeong, DesignCon 2017, DesignCon 2017, 2017-02-02 | |
| Design and Analysis of Hybrid Loop-array for High Efficiency and Low EMF Level in Wireless High Power Transfer System Kim, Joungho; Lee, Seongsoo; Cho, Yeonje; Kim, Hongseok; Song, Chiuk; Jeong, Seungtaek, IEEE Wireless Power Transfer Conference 2017, IEEE Wireless Power Transfer Conference 2017, 2017-05-10 | |
| Hierarchical Power Distribution Network Design in Fanout Wafer Level Package based Mobile AP-GPU for Multi-Media System Kim, Joungho; Kim, Youngwoo; Cho, Kyungjun; Park, Gapyeol; Kim, Subin, 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, 2017-06-22 | |
| Design and Analysis of Chip-level Wireless Power Transfer Using Magnetic-field Resonance Coupling and 0.18 um CMOS Technology Kim, Joungho; Song, Jinwook; Jeong, Seungtaek; Park, Shinyoung, Asia-Pacific International Symposium on Electromagnetic Compatibility, Asia-Pacific International Symposium on Electromagnetic Compatibility, 2017-06-22 | |
| Signal Integrity Analysis of High Speed Connector for Multi-Media System Kim, Joungho; Song, Huijin; Kim, Jonghoon; Park, Junyong; Lee, Junho; Choi, Seongmin, Asia-Pacific International Symposium on Electromagnetic Compatibility, Asia-Pacific International Symposium on Electromagnetic Compatibility, 2017-06-22 | |
| Analysis of Power Inverter Parasitic Inductances Effect on Switching Characteristics for Accurate Electromagnetic Interference (EMI) Estimation Park, Gyeyoung; Kim, Joungho; Song, Jinwook; Jung, Seungtaek; Kim, Youngwoo; Shim, Hyunwoo, 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017, pp.277 - 282, Institute of Electrical and Electronics Engineers Inc., 2017-08-06 |
Discover
Type
- 28 Conference