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Results 1-10 of 23 (Search time: 0.005 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Thermal Effects on Through-Silicon-Via (TSV) Signal Integrity

Lee, Manho; Cho, Jonghyun; Pak, Jun So; Lee, Hyungdong; Kim, Joungho, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29

2
Electrical Performance of 3D TSV Channel and 3D Stacked PDN based on Hierarchical Models

Pak, Jun So; Kim, Joohee; Cho, Jonghyun; Kim, Heegon; Kim, Joungho, 2011 Design, Automation & Test in Europe (DATE) Conference, 2011 Design, Automation & Test in Europe (DATE) Conference, 2011-03-01

3
Basic Analysis of Signal and Power Integrity of TSV Applications

Pak, Jun So; Kim, Heegon; Cho, Jonghyun; Kim, Joohee; Kim, Kiyeong; Kim, Joungho, 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012), 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012), 2012-05-18

4
Suppression of Power Distribution Network(PDN) Resonances in Glass Interposer

Kim, Joungho; Kim, Youngwoo; Cho, Jonghyun, Global Interposer Workshop 2013, Global Interposer Workshop 2013 in Georgia Institute of Technology, 2013-11-17

5
Investigation of LC-VCO Performance Degradation due to TSV-Coupled Noise in 3D IC

Kim, Joungho; Lim, Jaemin; Cho, Jonghyun; Lee, Manho; Park, Kunwoo; Lee, Junho, 2013 Asia-Pacific Radio Science Conference (AP-RASC 2013), 2013 Asia-Pacific Radio Science Conference (AP-RASC 2013), 2013-09-03

6
Design of a Mobile AP GPU PDN based on Chip Power Model and Measurement

Kim, Youngwoo; Kim, Joungho; Kim, Heegon; Cho, Jonghyun; Kang, Kibum; Yang, Taisik; Paik, Woohyun, DesignCon 2016, DesignCon 2016, 2016-01-19

7
Design and Implementation of On-chip Embedded Current Probe Using Magnetic Field Coupling in Chip to Chip Wireless Power Transfer System

Cho, Changhyun; Cho, Jonghyun; Kim, Myunghoi; Kim, Joungho; Pak, Jun So, 2012 IEEE MTT-S International Microwave Workshop Series (IMWS) on Innovative Wireless Power Transmission, 2012 IEEE MTT-S International Microwave Workshop Series (IMWS) on Innovative Wireless Power Transmission, 2012-05-11

8
Si-interposer Design for GPU-Memory Integration concerning the Signal Integrity

Kim, Joungho; Kim, Lee-Sup; Cho, Jonghyun; Kim, Joohee; Bae, Hyuncheol; Choi, Kwangseong; Paek, Seungwook, 2013 Design Con, 2013 Design Con, 2013-01-31

9
How to Improve Power Integrity on Analog-to-Digital Converter (ADC) with Chip-PCB Hierarchical Structure

Kim, Joungho; Bae, Bumhee; Cho, Jonghyun; Kong, Sunkyu; Kim, Jonghoon J; Shim, Yujeing, 2013 Design Con, 2013 Design Con, 2013-01-31

10
A Compact On-interposer Passive Equalizer for Chip-to-chip High-speed Data Transmission

Kim, Heegon; Cho, Jonghyun; Kim, Joohee; Kim, Kiyeong; Choi, Sumin; Kim, Joungho; Pak, Jun So, 21th Conference on Electrical Performance of Electronic Packaging and Systems, IEEE, 2012-10-23

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