Results 1-10 of 23 (Search time: 0.005 seconds).
NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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A Fast and Efficient Modeling Method for Chip-Package-PCB Hierarchical Power Distribution Network Kim, Joungho; Kim, Jaemin; Shim, Jongjoo; Pak, JunSo, IEEE Electrical Design of Advanced Packaging and Systems Symposium, 2008 | |
An On-Chip Signal Integrity Characterization Scheme for Gbps Data Transmission Channel Kim, Joungho; Cho, Jeonghyeon; Song, Eakhwan; Lee, Woojin, Presented at XXIX General Assembly of International Union of Radio Science (URSIGA 2008), 2008 | |
Experimental verification and analysis for noise isolation of analog and digital chip-package-PCB hierarchical power distribution network Park, H.; Shim, J.; Shim, Y.; Yoo, J.; Kim, Joungho, IEEE 9th VLSI Packaging Workshop in Japan, VPWJ 2008, pp.73 - 76, 2008-12-01 | |
A Frequency Clock Distribution Scheme Using Bond-Wire Inductor Kim, Joungho; Lee, Woojin; Pak, Jun So; Pak, Jiwoo; Ryu, Chunghyun; Park, Jongbae, IEEE Electrical Design of Advanced Packaging and Systems Symposium, 2008 | |
Multi-Stacking Through-Silicon-Via Effects on Signal Integrity and Power Integrity for Application of 3-Dimensional Stacked-Chip-Package Kim, Joungho; Pak, Jun So; Ryu, Chunghyun, Presented at XXIX General Assembly of International Union of Radio Science (URSIGA 2008), 2008 | |
A 6.4Gbps On-chip Eye Opening Monitor Circuit for Signal Integrity Analysis of High Speed Channel Kim, Joungho; Shin, Mincheol; Shim, Jongjoo; Kim, Jaemin; Pak, Jun So; Hwang, Chulsoon; Yoon, Changwook; Kim, Hyungsoo; Park, Kunwoo; Kim, Yongju, Presented at Proceeding of 2008 IEEE EMC Symposium, pp.1 - 7, 2008-08 | |
Impact of partial EBG PDN on PI, SI and lumped model-based correlation Lee, J.; Lee, H.; Park, K.; Chung, B.; Kim, J.; Kim, Joungho, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.168 - 171, 2008-05-19 | |
3D strip meander delay line structure for multilayer LTCC-based SiP applications Kim, G.; Lu A.C.W.; Wei, F.; Wai, L.L.; Kim, Joungho, 2008 58th Electronic Components and Technology Conference, ECTC, pp.2081 - 2085, 2008-05-27 | |
Analysis and Modeling of Delay and Crosstalk in Differential Meander Delay Line on Based on A Time Domain Mode Impedances Kim, Joungho; Kim, Gawon; Kim, Jaemin; Lee, Sangrok, IEEE Electrical Design of Advanced Packaging and Systems Symposium, 2008 | |
A dual-slope signaling scheme to suppress electromagnetic interference (EMI) with sustaining eye margin Yoon, C.; Baek, S.; Lee, H.; Jeong, Y.; Park, J.; Park, H.; Sung, B.; Kim, Joungho, 17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008, pp.143 - 146, 2008-10-27 |
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