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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Via: A Source of Simultaneous Switching Noise Generation, Coupling, and Edge Radiation in High-speed Multi-layer Digital PCB Kim, Joungho; Park, Jongbae; Pak, Jun So; Kim, Hyungsoo, 2004 Korea-Japan Joint Conference on AP/EMC/EMT (KJJC), pp.22 - 23, 2004-11 | |
| Balanced TLM and Coupling Model for Analysis of Power/Ground Resonance, Noise Coupling, and Edge Radiation Kim, Joungho; Pak, Jun So; Lee, Jongbae; Kim, Hyungsoo; Lee, H.J; Choi, C.S, Electromagnetic Compatibility Conference, pp.505 - 508, 2004 | |
| A 6.4Gbps On-chip Eye Opening Monitor Circuit for Signal Integrity Analysis of High Speed Channel Kim, Joungho; Shin, Mincheol; Shim, Jongjoo; Kim, Jaemin; Pak, Jun So; Hwang, Chulsoon; Yoon, Changwook; Kim, Hyungsoo; Park, Kunwoo; Kim, Yongju, Presented at Proceeding of 2008 IEEE EMC Symposium, pp.1 - 7, 2008-08 | |
| 3 GHz Wide Frequency Model of Surface Mount Technology (SMT) Ferrite Bead for Power/Ground and I/O Line Noise Simulation of High-speed PCB Kim, Tae Hong; Kim, Hyungsoo; Pak, Jun So; Kim, Joungho, IEEE 7th Workshop on Signal Propagation on Interconnects, pp.181 - 284, IEEE, 2010-11-15 | |
| Prediction and Verification of Power/Ground Plane Edge Radiation Excited by Through-Hole Signal Via Based on Balanced TLM and Via Coupling Model Pak, Jun So; Lee, Junwoo; Kim, Hyungsoo; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.181 - 184, IEEE, 2003-10-27 |
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