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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Thermal Effects on Through-Silicon-Via (TSV) Signal Integrity Lee, Manho; Cho, Jonghyun; Pak, Jun So; Lee, Hyungdong; Kim, Joungho, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 | |
| Electrical Performance of 3D TSV Channel and 3D Stacked PDN based on Hierarchical Models Pak, Jun So; Kim, Joohee; Cho, Jonghyun; Kim, Heegon; Kim, Joungho, 2011 Design, Automation & Test in Europe (DATE) Conference, 2011 Design, Automation & Test in Europe (DATE) Conference, 2011-03-01 | |
| Basic Analysis of Signal and Power Integrity of TSV Applications Pak, Jun So; Kim, Heegon; Cho, Jonghyun; Kim, Joohee; Kim, Kiyeong; Kim, Joungho, 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012), 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012), 2012-05-18 | |
| Design and Implementation of On-chip Embedded Current Probe Using Magnetic Field Coupling in Chip to Chip Wireless Power Transfer System Cho, Changhyun; Cho, Jonghyun; Kim, Myunghoi; Kim, Joungho; Pak, Jun So, 2012 IEEE MTT-S International Microwave Workshop Series (IMWS) on Innovative Wireless Power Transmission, 2012 IEEE MTT-S International Microwave Workshop Series (IMWS) on Innovative Wireless Power Transmission, 2012-05-11 | |
| A Compact On-interposer Passive Equalizer for Chip-to-chip High-speed Data Transmission Kim, Heegon; Cho, Jonghyun; Kim, Joohee; Kim, Kiyeong; Choi, Sumin; Kim, Joungho; Pak, Jun So, 21th Conference on Electrical Performance of Electronic Packaging and Systems, IEEE, 2012-10-23 | |
| Nonlinear Effects of TSV and Harmonic Generation Cho, Jonghyun; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; Pak, Kunwoo, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 | |
| High-frequency Measurements of TSV failures Kim, Joohee; Cho, Jonghyun; Pak, Jun So; Kim, Joungho; Yook, Jong-Min; Kim, Jun Chul, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 | |
| High-Freuquency TSV Failure Analysis Kim, Joohee; Cho, Jonghyun; Jung, Hyunsuk; Pak, Jun So; Yook, Jong-Min; Kim, Joungho; Kim, Jun Chul, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24 | |
| Through-Silicon Via (TSV) Depletion Effect Cho, Jonghyun; Kim, Myunghoi; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; Pak, Kunwoo, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24 |
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