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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| High frequency electrical circuit model of chip-to-chip vertical via iterconnection for 3-D chip stacking package Ryu, C.; Chung, D.; Lee, J.; Lee, K.; Oh, T.; Kim, Joungho, 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005, v.2005, pp.151 - 154, 2005-10-24 | |
| System-on-Package ultra wideband transmitter with integrated bandpass filter and broad band planar antenna Kim, M.; Lee, J.; Park, Y.-J.; Kim, Joungho, 55th Electronic Components and Technology Conference, ECTC, pp.541 - 544, IEEE, 2005-05-31 | |
| Broadband suppression of SSN and radiated emissions using high-DK thin film EBG power distribution network for high-speed digital PCB applications Lee, J.; Kim, H.; Kim, Joungho, International Symposium on Electromagnetic Compatibility, EMC 2005, pp.967 - 970, IEEE, 2005-08-08 |
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