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Results 1-10 of 30 (Search time: 0.007 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Effect of ground guard fence with via and ground slot on radiated emission in multi-layer digital printed circuit board Lee, H.; Kim, J.; Ahn, S.; Byun, J.-G.; Kang, D.-S.; Choi, C.-S.; Hwang, H.-J.; Kim, Joungho, 2001 IEEE International Symposium on Electromagnetic Compatibility, v.1, pp.653 - 656, IEEE, 2001-08-13 | |
| GHz twisted differential line structure on printed circuit board to minimize EMI and crosstalk noises Kam, D.G.; Lee, H.; Baek, S.; Park, B.; Kim, Joungho, 52nd Electronic Components and Technology Conference, pp.1058 - 1065, 2002-05-28 | |
| Effect of power/ground partitioning and stitching capacitor placement on signal integrity and emi of multi-layer and multi power system Kim, Joungho; Kim, H.; Lee, H.; Kim, J.; Kim, J., Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.59 - 62, 2001-07-08 | |
| An evaluation of differential impedance in PCBs using two single-ended probes only Kam, D.G.; Lee, H.; Ryu, W.; Kim, J.; Park, B.; Kim, Joungho, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.169 - 171, IEEE, 2002-05-12 | |
| Verification of Picosecond Sampling for Electromagnetic Transient Scattering Experiment in Terahertz Spectrum Region Kim, Joungho; Lee, H.; Ryu, J.; Kim, W., 7th IEEE International Conference on Terahertz Electronics, pp.272 - 275, 1999 | |
| Compact Terahertz Imaging System Using Near-Field Probe Kim, Joungho; Ryu, J.; Kim, W.; Lee, H., 7th IEEE International Conference on Terahertz Electronics, pp.81 - 84, 1999-11 | |
| Analysis of power distribution network in TSV-based 3D-IC Kim, K.; Lee, W.; Kim, J.; Song, T.; Kim, J.; Pak, J.S.; Kim, Joungho; Lee, H.; Kwon, Y.; Park, K., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.177 - 180, IEEE, 2010-10-25 | |
| Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole Lee, H.; Hong, Y.-S.; Kam, D.; Kim, Joungho, Proceedings - 8th IEEE Workshop on Signal Propagation on Interconnects, pp.31 - 34, 2004-05-09 | |
| I/O power estimation and analysis of high-speed channels in Through-Silicon Via (TSV)-based 3D IC Kim, Joungho; Cho, J.; Pak, J.S.; Song, T.; Kim, J.; Lee, H.; Lee, J.; Park, K., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.41 - 44, IEEE, 2010-10-25 | |
| Through Silicon Via (TSV) shielding structures Cho, J.; Kim, Joungho; Song, T.; Pak, J.S.; Kim, J.; Lee, H.; Lee, J.; Park K., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.269 - 272, IEEE, 2010-10-25 |
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