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Results 1-1 of 1 (Search time: 0.007 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Through silicon via (TSV) equalizer

Kim, Joungho; Song, E.; Cho, J.; Pak, J.S.; Lee, J.; Lee, H.; Kim, J., 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.13 - 16, 123, 2009-10-19

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