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Results 1-2 of 2 (Search time: 0.004 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
Modeling and analysis of die-to-die vertical coupling in 3-D IC

Lee, S.; Kim, G.; Kim, J.; Song, T.; Lee, J.; Lee, H.; Park, K.; Kim, Jounghoresearcher, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.707 - 711, 2009-12-09

Chip-package co-modeling & verification of noise coupling & generation in CMOS DC/DC buck converter

Song, T.; Kim, J.; Pak, J.; Kim, Jounghoresearcher, 20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009, pp.285 - 288, IEEE, 2009-01-12

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