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Results 1-1 of 1 (Search time: 0.004 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Networks-in-package; design, analysis and implementation

Kim, G.; Lee, K.; Kim, J.; Bae, K.; Lee, C.; Yoo, H.-J.; Kim, Joungho, 14th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP, pp.221 - 224, IEEE, 2006-10-23

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