Search

Start a new search
Current filters:
Add filters:
  • Results/Page
  • Sort items by
  • In order
  • Authors/record

Results 1-9 of 9 (Search time: 0.006 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Impact of PCB design on switching noise and EMI of synchronous DC-DC buck converter

Koo, K.; Kim, J.; Kim, M.; Kim, Jounghoresearcher, 2010 IEEE International Symposium on Electromagnetic Compatibility, EMC 2010, pp.67 - 71, IEEE, 2010-07-25

2
A compact, low-cost, and wide-band passive equalizer design using multi-layer PCB parasitics

Song, E.; Kim, J.; Kim, Jounghoresearcher; Cho, J., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.165 - 168, IEEE, 2010-10-25

3
TSV modeling and noise coupling in 3D IC

Kim, Jounghoresearcher; Cho, J.; Kim, J., 3rd Electronics System Integration Technology Conference, ESTC 2010, ESTC 2010, 2010-09-13

4
Analysis of power distribution network in TSV-based 3D-IC

Kim, K.; Lee, W.; Kim, J.; Song, T.; Kim, J.; Pak, J.S.; Kim, Jounghoresearcher; Lee, H.; Kwon, Y.; Park, K., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.177 - 180, IEEE, 2010-10-25

5
I/O power estimation and analysis of high-speed channels in Through-Silicon Via (TSV)-based 3D IC

Kim, Jounghoresearcher; Cho, J.; Pak, J.S.; Song, T.; Kim, J.; Lee, H.; Lee, J.; Park, K., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.41 - 44, IEEE, 2010-10-25

6
Through Silicon Via (TSV) shielding structures

Cho, J.; Kim, Jounghoresearcher; Song, T.; Pak, J.S.; Kim, J.; Lee, H.; Lee, J.; Park K., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.269 - 272, IEEE, 2010-10-25

7
Slow wave and dielectric quasi-TEM modes of metal-insulator-semiconductor (MIS) structure through silicon via (TSV) in signal propagation and power delivery in 3D chip package

Pak, Jun So; Cho, J.; Kim, J.; Lee, J.; Lee, H.; Park, K.; Kim, Jounghoresearcher, 60th Electronic Components and Technology Conference, ECTC 2010, pp.667 - 672, ECTC 2010, 2010-06-01

8
Guard ring effect for Through Silicon Via (TSV) noise coupling reduction

Cho, J.; Yoon, K.; Pak, J.S.; Kim, J.; Lee, J.; Lee, H.; Park, K.; Kim, Jounghoresearcher, 2010 IEEE CPMT Symposium Japan, ICSJ10, IEEE, 2010-08-24

9
Modeling and analysis of differential signal Through Silicon Via (TSV) in 3D IC

Kim, J.; Pak, J.S.; Cho, J.; Lee, J.; Lee, H.; Park, K.; Kim, Jounghoresearcher, 2010 IEEE CPMT Symposium Japan, ICSJ10, IEEE, 2010-08-24

rss_1.0 rss_2.0 atom_1.0