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Results 1-8 of 8 (Search time: 0.002 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Analysis of power distribution network in TSV-based 3D-IC

Kim, K.; Lee, W.; Kim, J.; Song, T.; Kim, J.; Pak, J.S.; Kim, Jounghoresearcher; Lee, H.; Kwon, Y.; Park, K., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.177 - 180, IEEE, 2010-10-25

2
I/O power estimation and analysis of high-speed channels in Through-Silicon Via (TSV)-based 3D IC

Kim, Jounghoresearcher; Cho, J.; Pak, J.S.; Song, T.; Kim, J.; Lee, H.; Lee, J.; Park, K., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.41 - 44, IEEE, 2010-10-25

3
Slow wave and dielectric quasi-TEM modes of metal-insulator-semiconductor (MIS) structure through silicon via (TSV) in signal propagation and power delivery in 3D chip package

Pak, Jun So; Cho, J.; Kim, J.; Lee, J.; Lee, H.; Park, K.; Kim, Jounghoresearcher, 60th Electronic Components and Technology Conference, ECTC 2010, pp.667 - 672, ECTC 2010, 2010-06-01

4
Impact of partial EBG PDN on PI, SI and lumped model-based correlation

Lee, J.; Lee, H.; Park, K.; Chung, B.; Kim, J.; Kim, Jounghoresearcher, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.168 - 171, 2008-05-19

5
Modeling and analysis of die-to-die vertical coupling in 3-D IC

Lee, S.; Kim, G.; Kim, J.; Song, T.; Lee, J.; Lee, H.; Park, K.; Kim, Jounghoresearcher, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.707 - 711, 2009-12-09

6
Guard ring effect for Through Silicon Via (TSV) noise coupling reduction

Cho, J.; Yoon, K.; Pak, J.S.; Kim, J.; Lee, J.; Lee, H.; Park, K.; Kim, Jounghoresearcher, 2010 IEEE CPMT Symposium Japan, ICSJ10, IEEE, 2010-08-24

7
Modeling and analysis of differential signal Through Silicon Via (TSV) in 3D IC

Kim, J.; Pak, J.S.; Cho, J.; Lee, J.; Lee, H.; Park, K.; Kim, Jounghoresearcher, 2010 IEEE CPMT Symposium Japan, ICSJ10, IEEE, 2010-08-24

8
Sharing power distribution networks for enhanced power integrity by using through-silicon-via

Pak, J.S.; Kim, Jounghoresearcher; Lee, J.; Lee, H.; Park, K.; Kim, J., 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.9 - 12, IEEE, 2008-12-10

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