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Results 1-10 of 15 (Search time: 0.006 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Radiated emission from Plasma Display Panel (PDP) depending on addressing line structure and current driving scheme

Jeong, Y.; Lee, J.; Kim, J.; Choi, S.; Kim, Jounghoresearcher; Park, H.H.; Kang, K.; Kim, H.; Whang, K., 2002 IEEE International Symposium on Electromagnetic Compatibility, v.1, pp.140 - 143, IEEE, 2002-08-19

2
Slot transmission line model of interconnections crossing split power/ground plane on high-speed multi-layer board

Kim, Jounghoresearcher; Kim, H.; Jeong, Y.; Lee, J.; Kim, J., 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.23 - 26, 2002-05-12

3
I/O power estimation and analysis of high-speed channels in Through-Silicon Via (TSV)-based 3D IC

Kim, Jounghoresearcher; Cho, J.; Pak, J.S.; Song, T.; Kim, J.; Lee, H.; Lee, J.; Park, K., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.41 - 44, IEEE, 2010-10-25

4
Through silicon via (TSV) equalizer

Kim, Jounghoresearcher; Song, E.; Cho, J.; Pak, J.S.; Lee, J.; Lee, H.; Kim, J., 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.13 - 16, 2009-10-19

5
Through Silicon Via (TSV) shielding structures

Cho, J.; Kim, Jounghoresearcher; Song, T.; Pak, J.S.; Kim, J.; Lee, H.; Lee, J.; Park K., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.269 - 272, IEEE, 2010-10-25

6
Slow wave and dielectric quasi-TEM modes of metal-insulator-semiconductor (MIS) structure through silicon via (TSV) in signal propagation and power delivery in 3D chip package

Pak, Jun So; Cho, J.; Kim, J.; Lee, J.; Lee, H.; Park, K.; Kim, Jounghoresearcher, 60th Electronic Components and Technology Conference, ECTC 2010, pp.667 - 672, ECTC 2010, 2010-06-01

7
Impact of partial EBG PDN on PI, SI and lumped model-based correlation

Lee, J.; Lee, H.; Park, K.; Chung, B.; Kim, J.; Kim, Jounghoresearcher, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.168 - 171, 2008-05-19

8
Modeling and analysis of die-to-die vertical coupling in 3-D IC

Lee, S.; Kim, G.; Kim, J.; Song, T.; Lee, J.; Lee, H.; Park, K.; Kim, Jounghoresearcher, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.707 - 711, 2009-12-09

9
Guard ring effect for Through Silicon Via (TSV) noise coupling reduction

Cho, J.; Yoon, K.; Pak, J.S.; Kim, J.; Lee, J.; Lee, H.; Park, K.; Kim, Jounghoresearcher, 2010 IEEE CPMT Symposium Japan, ICSJ10, IEEE, 2010-08-24

10
Modeling and analysis of differential signal Through Silicon Via (TSV) in 3D IC

Kim, J.; Pak, J.S.; Cho, J.; Lee, J.; Lee, H.; Park, K.; Kim, Jounghoresearcher, 2010 IEEE CPMT Symposium Japan, ICSJ10, IEEE, 2010-08-24

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