Search

Start a new search
Current filters:
Add filters:
  • Results/Page
  • Sort items by
  • In order
  • Authors/record

Results 1-10 of 16 (Search time: 0.005 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Effect of ground guard fence with via and ground slot on radiated emission in multi-layer digital printed circuit board

Lee, H.; Kim, J.; Ahn, S.; Byun, J.-G.; Kang, D.-S.; Choi, C.-S.; Hwang, H.-J.; Kim, Jounghoresearcher, 2001 IEEE International Symposium on Electromagnetic Compatibility, v.1, pp.653 - 656, IEEE, 2001-08-13

2
Equivalent circuit representation and dimension reduction technique for efficient FDTD modeling of power/ground plane

Lee, H.; Kim, H.; Kim, Jounghoresearcher; Jeong, Y.C.; Kim, J., IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2001, pp.145 - 148, IEEE, 2001-10-29

3
Effect of power/ground partitioning and stitching capacitor placement on signal integrity and emi of multi-layer and multi power system

Kim, Jounghoresearcher; Kim, H.; Lee, H.; Kim, J.; Kim, J., Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.59 - 62, 2001-07-08

4
An evaluation of differential impedance in PCBs using two single-ended probes only

Kam, D.G.; Lee, H.; Ryu, W.; Kim, J.; Park, B.; Kim, Jounghoresearcher, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.169 - 171, IEEE, 2002-05-12

5
Analysis of power distribution network in TSV-based 3D-IC

Kim, K.; Lee, W.; Kim, J.; Song, T.; Kim, J.; Pak, J.S.; Kim, Jounghoresearcher; Lee, H.; Kwon, Y.; Park, K., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.177 - 180, IEEE, 2010-10-25

6
I/O power estimation and analysis of high-speed channels in Through-Silicon Via (TSV)-based 3D IC

Kim, Jounghoresearcher; Cho, J.; Pak, J.S.; Song, T.; Kim, J.; Lee, H.; Lee, J.; Park, K., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.41 - 44, IEEE, 2010-10-25

7
Experimental investigation of radiated emission from flexible printed circuit (FPC) cable

Ahn, S.; Kim, J.; Lee, H.; Kim, Jounghoresearcher; Byun, J.-G.; Choi, C.-S.; Hwang, H.-J., IEEE International Symposium on Electromagnetic Compatibility, 2002, v.2, pp.883 - 888, IEEE, 2002-08-19

8
Through silicon via (TSV) equalizer

Kim, Jounghoresearcher; Song, E.; Cho, J.; Pak, J.S.; Lee, J.; Lee, H.; Kim, J., 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.13 - 16, 2009-10-19

9
Through Silicon Via (TSV) shielding structures

Cho, J.; Kim, Jounghoresearcher; Song, T.; Pak, J.S.; Kim, J.; Lee, H.; Lee, J.; Park K., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.269 - 272, IEEE, 2010-10-25

10
Slow wave and dielectric quasi-TEM modes of metal-insulator-semiconductor (MIS) structure through silicon via (TSV) in signal propagation and power delivery in 3D chip package

Pak, Jun So; Cho, J.; Kim, J.; Lee, J.; Lee, H.; Park, K.; Kim, Jounghoresearcher, 60th Electronic Components and Technology Conference, ECTC 2010, pp.667 - 672, ECTC 2010, 2010-06-01

rss_1.0 rss_2.0 atom_1.0