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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Slot transmission line model of interconnections crossing split power/ground plane on high-speed multi-layer board Kim, Joungho; Kim, H.; Jeong, Y.; Lee, J.; Kim, J., 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.23 - 26, 2002-05-12 | |
| Effect of power/ground partitioning and stitching capacitor placement on signal integrity and emi of multi-layer and multi power system Kim, Joungho; Kim, H.; Lee, H.; Kim, J.; Kim, J., Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.59 - 62, 2001-07-08 | |
| A chip-package hybrid DLL loop and clock distribution network for low-jitter clock delivery Chung, D.; Ryu, C.; Kim, H.; Lee, C.; Kim, J.; Kim, J.; Bae, K.; Yu, J.; Lee, S.; Yoo, H.; Kim, Joungho, 2005 IEEE International Solid-State Circuits Conference, ISSCC, v.48, pp.514 - 614, 2005-02-06 | |
| Separated role of on-chip and on-PCB decoupling capacitors for reduction of radiated emission on printed circuit board Kim, J.; Choi, B.; Kim, H.; Ryu, W.; Yun, Y.-H.; Ham, S.-H.; Lee, Y.-H.; Kim, Joungho, 2001 International Symposium on Electromagnetic Compatibility, pp.531 - 536, IEEE, 2001-08-13 | |
| Radiated emission from Plasma Display Panel (PDP) depending on addressing line structure and current driving scheme Jeong, Y.; Lee, J.; Kim, J.; Choi, S.; Kim, Joungho; Park, H.H.; Kang, K.; Kim, H.; Whang, K., 2002 IEEE International Symposium on Electromagnetic Compatibility, pp.140 - 143, IEEE, 2002-08-19 | |
| Equivalent circuit representation and dimension reduction technique for efficient FDTD modeling of power/ground plane Lee, H.; Kim, H.; Kim, Joungho; Jeong, Y.C.; Kim, J., IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2001, pp.145 - 148, IEEE, 2001-10-29 | |
| Controlled power/ground noise on multi-layer digital printed circuit board using adaptive CMOS output driving scheme Kim, H.; Ryu, W.; Kim, J.; Kim, Joungho, 2001 International Symposium on Electromagnetic Compatibility, pp.921 - 926, IEEE, 2001-08-13 |
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