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Results 1-9 of 9 (Search time: 0.005 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
A compact, low-cost, and wide-band passive equalizer design using multi-layer PCB parasitics

Song, E.; Kim, J.; Kim, Jounghoresearcher; Cho, J., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.165 - 168, IEEE, 2010-10-25

2
TSV modeling and noise coupling in 3D IC

Kim, Jounghoresearcher; Cho, J.; Kim, J., 3rd Electronics System Integration Technology Conference, ESTC 2010, ESTC 2010, 2010-09-13

3
I/O power estimation and analysis of high-speed channels in Through-Silicon Via (TSV)-based 3D IC

Kim, Jounghoresearcher; Cho, J.; Pak, J.S.; Song, T.; Kim, J.; Lee, H.; Lee, J.; Park, K., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.41 - 44, IEEE, 2010-10-25

4
Through silicon via (TSV) equalizer

Kim, Jounghoresearcher; Song, E.; Cho, J.; Pak, J.S.; Lee, J.; Lee, H.; Kim, J., 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.13 - 16, 2009-10-19

5
Through Silicon Via (TSV) shielding structures

Cho, J.; Kim, Jounghoresearcher; Song, T.; Pak, J.S.; Kim, J.; Lee, H.; Lee, J.; Park K., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.269 - 272, IEEE, 2010-10-25

6
Slow wave and dielectric quasi-TEM modes of metal-insulator-semiconductor (MIS) structure through silicon via (TSV) in signal propagation and power delivery in 3D chip package

Pak, Jun So; Cho, J.; Kim, J.; Lee, J.; Lee, H.; Park, K.; Kim, Jounghoresearcher, 60th Electronic Components and Technology Conference, ECTC 2010, pp.667 - 672, ECTC 2010, 2010-06-01

7
Guard ring effect for Through Silicon Via (TSV) noise coupling reduction

Cho, J.; Yoon, K.; Pak, J.S.; Kim, J.; Lee, J.; Lee, H.; Park, K.; Kim, Jounghoresearcher, 2010 IEEE CPMT Symposium Japan, ICSJ10, IEEE, 2010-08-24

8
Modeling and analysis of differential signal Through Silicon Via (TSV) in 3D IC

Kim, J.; Pak, J.S.; Cho, J.; Lee, J.; Lee, H.; Park, K.; Kim, Jounghoresearcher, 2010 IEEE CPMT Symposium Japan, ICSJ10, IEEE, 2010-08-24

9
A precise analytical eye-diagram estimation method for non-ideal high-speed channels

Cho, J.; Song, E.; Shim, J.; Kim, J.; Kim, Jounghoresearcher, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.159 - 162, IEEE, 2009-10-19

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