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Results 1-10 of 35 (Search time: 0.005 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Electrical Performance of 3D TSV Channel and 3D Stacked PDN based on Hierarchical Models Pak, Jun So; Kim, Joohee; Cho, Jonghyun; Kim, Heegon; Kim, Joungho, 2011 Design, Automation & Test in Europe (DATE) Conference, 2011 Design, Automation & Test in Europe (DATE) Conference, 2011-03-01 | |
| Basic Analysis of Signal and Power Integrity of TSV Applications Pak, Jun So; Kim, Heegon; Cho, Jonghyun; Kim, Joohee; Kim, Kiyeong; Kim, Joungho, 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012), 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012), 2012-05-18 | |
| Magnetically-Coupled Current Probing Structures and Method for Reconstruction of Switching Current Kim, Joungho; Kim, Jonghoon J.; Kim, Heegon; Cho, Chang Hyun, DesignCon 2017, DesignCon 2017, 2017-02-01 | |
| Design and analysis of high bandwidth memory (HBM) interposer Considering Signal and Power integirty (SI/PI) for terabyte/s bandwidth system Kim, Joungho; Cho, Kyungjun; Lee, Hyunsuk; Kim, Heegon; Kim, Youngwoo; Choi, Sumin; Kim, Subin; Kim, Hyungsoo, DesignCon 2017, DesignCon 2017, 2017-02-01 | |
| Crosstalk Effects on Eye-Diagram and BER for High-Bandwidth Memory Channel Kim, Joungho; Choi, Sumin; Kim, Heegon; Kim, Kiyeong, DesignCon 2017, DesignCon 2017, 2017-02-02 | |
| Crosstalk Reduction Passive Equalizer using MIM Capacitor between Differential Signaling Pairs on High-speed Interposer Kim, Joungho; Choi, Sumin; Kim, Heegon; Kim, Sukjin; Kim, Kiyeong; Lee, Junho; Park, Kunwoo, 2013 Asia Pacific – Radio Science Conference, 2013 Asia Pacific – Radio Science Conference, 2013-09-06 | |
| Design of a Mobile AP GPU PDN based on Chip Power Model and Measurement Kim, Youngwoo; Kim, Joungho; Kim, Heegon; Cho, Jonghyun; Kang, Kibum; Yang, Taisik; Paik, Woohyun, DesignCon 2016, DesignCon 2016, 2016-01-19 | |
| Design and Analysis of Silicone Rubber-based TERAPOSER for LPDDR4 Memory Test Kim, Jonghoon J; Kim, Joungho; Park, Junyong; Kim, Heegon; Bae, Bumhee; Jung, Daniel H; Ha, Dongho; Bae, Michael, DesignCon 2016, DesignCon 2016, 2016-01-19 | |
| Analysis on Via Design for Impedance Mismatch Minimization in High Speed Channel Lim, Jaemin; Kim, Joungho; Kim, Heegon; Kim, Dong-Hyun; Jeon, Yeseul; Koh, Wee Jin; Chang Weng Yew Richard, Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), 2016-05-19 | |
| Analysis of Vertical PCB Connector Induced Via Stub Reduction in High Speed Serial Link Kim, Dong-Hyun; Kim, Joungho; Kim, Heegon; Lim, Jaemin; Jeon, Yeseul; Koh, Wee Jin; Chang, Weng Yew Richard, Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), 2016-05-19 |