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Results 1-10 of 182 (Search time: 0.003 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Impact of PCB design on switching noise and EMI of synchronous DC-DC buck converter

Koo, K.; Kim, J.; Kim, M.; Kim, Jounghoresearcher, 2010 IEEE International Symposium on Electromagnetic Compatibility, EMC 2010, pp.67 - 71, IEEE, 2010-07-25

2
A compact, low-cost, and wide-band passive equalizer design using multi-layer PCB parasitics

Song, E.; Kim, J.; Kim, Jounghoresearcher; Cho, J., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.165 - 168, IEEE, 2010-10-25

3
TSV modeling and noise coupling in 3D IC

Kim, Jounghoresearcher; Cho, J.; Kim, J., 3rd Electronics System Integration Technology Conference, ESTC 2010, ESTC 2010, 2010-09-13

4
A designated clock generation and distribution (DCGD) chip scheme for substrate noise-free 3-D stacked SiP design

Lee, W.; Ryu, C.; Cho, J.; Song, E.; Kim, Jounghoresearcher, 2010 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2010, pp.334 - 337, APEMC 2010, 2010-04-12

5
Analysis of power distribution network in TSV-based 3D-IC

Kim, K.; Lee, W.; Kim, J.; Song, T.; Kim, J.; Pak, J.S.; Kim, Jounghoresearcher; Lee, H.; Kwon, Y.; Park, K., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.177 - 180, IEEE, 2010-10-25

6
I/O power estimation and analysis of high-speed channels in Through-Silicon Via (TSV)-based 3D IC

Kim, Jounghoresearcher; Cho, J.; Pak, J.S.; Song, T.; Kim, J.; Lee, H.; Lee, J.; Park, K., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.41 - 44, IEEE, 2010-10-25

7
Through-Silicon Via (TSV) Depletion Effect

Cho, Jonghyun; Kim, Myunghoi; Kim, Joohee; Pak, Jun So; Kim, Jounghoresearcher; Lee, Hyungdong; Lee, Junho; Pak, Kunwoo, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24

8
A Compact On-interposer Passive Equalizer for Chip-to-chip High-speed Data Transmission

Kim, Heegon; Cho, Jonghyun; Kim, Joohee; Kim, Kiyeong; Choi, Sumin; Kim, Jounghoresearcher; Pak, Jun So, 21th Conference on Electrical Performance of Electronic Packaging and Systems, IEEE, 2012-10-23

9
Differential signal via shield with narrow via pitch partial electromagnetic bandgap structure

Hwang, C.; Shin, M.; Pak, J.S.; Kim, Jounghoresearcher, 2010 IEEE International Symposium on Electromagnetic Compatibility, EMC 2010, pp.451 - 454, IEEE, 2010-07-25

10
Nonlinear Effects of TSV and Harmonic Generation

Cho, Jonghyun; Kim, Joohee; Pak, Jun So; Kim, Jounghoresearcher; Lee, Hyungdong; Lee, Junho; Pak, Kunwoo, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29

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