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Results 1-10 of 28 (Search time: 0.003 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Via: A Source of Simultaneous Switching Noise Generation, Coupling, and Edge Radiation in High-speed Multi-layer Digital PCB

Kim, Jounghoresearcher; Park, Jongbae; Pak, Jun So; Kim, Hyungsoo, 2004 Korea-Japan Joint Conference on AP/EMC/EMT (KJJC), pp.22 - 23, 2004-11

2
Balanced TLM and Coupling Model for Analysis of Power/Ground Resonance, Noise Coupling, and Edge Radiation

Kim, Jounghoresearcher; Pak, Jun So; Lee, Jongbae; Kim, Hyungsoo; Lee, H.J; Choi, C.S, Electromagnetic Compatibility Conference, pp.505 - 508, 2004

3
Through-Silicon Via (TSV) Depletion Effect

Cho, Jonghyun; Kim, Myunghoi; Kim, Joohee; Pak, Jun So; Kim, Jounghoresearcher; Lee, Hyungdong; Lee, Junho; Pak, Kunwoo, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24

4
A Compact On-interposer Passive Equalizer for Chip-to-chip High-speed Data Transmission

Kim, Heegon; Cho, Jonghyun; Kim, Joohee; Kim, Kiyeong; Choi, Sumin; Kim, Jounghoresearcher; Pak, Jun So, 21th Conference on Electrical Performance of Electronic Packaging and Systems, IEEE, 2012-10-23

5
Nonlinear Effects of TSV and Harmonic Generation

Cho, Jonghyun; Kim, Joohee; Pak, Jun So; Kim, Jounghoresearcher; Lee, Hyungdong; Lee, Junho; Pak, Kunwoo, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29

6
Design and Implementation of On-chip Embedded Current Probe Using Magnetic Field Coupling in Chip to Chip Wireless Power Transfer System

Cho, Changhyun; Cho, Jonghyun; Kim, Myunghoi; Kim, Jounghoresearcher; Pak, Jun So, 2012 IEEE MTT-S International Microwave Workshop Series (IMWS) on Innovative Wireless Power Transmission, 2012 IEEE MTT-S International Microwave Workshop Series (IMWS) on Innovative Wireless Power Transmission, 2012-05-11

7
Effects of On-Chip Decoupling Capacitors and Silicon Substrate on Power Distribution Networks in TSV-based 3D-Ics

Kim, Kiyong; Pak, Jun So; Lee, Hyungdong; Kim, Jounghoresearcher, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29

8
Thermal Effects on Through-Silicon-Via (TSV) Signal Integrity

Lee, Manho; Cho, Jonghyun; Pak, Jun So; Lee, Hyungdong; Kim, Jounghoresearcher, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29

9
TSV-based Decoupling Capacitor Schemes in 3D-IC

Song, Eunseok; Pak, Jun So; Kim, Jounghoresearcher, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29

10
High-frequency Measurements of TSV failures

Kim, Joohee; Cho, Jonghyun; Pak, Jun So; Kim, Jounghoresearcher; Yook, Jong-Min; Kim, Jun Chul, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29

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