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Results 1-10 of 35 (Search time: 0.003 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Radiated emission from Plasma Display Panel (PDP) depending on addressing line structure and current driving scheme

Jeong, Y.; Lee, J.; Kim, J.; Choi, S.; Kim, Jounghoresearcher; Park, H.H.; Kang, K.; Kim, H.; Whang, K., 2002 IEEE International Symposium on Electromagnetic Compatibility, v.1, pp.140 - 143, IEEE, 2002-08-19

2
Picosecond-pulse propagation measurement on microstrip meander lines using a novel optical near-field mapping probe

Lee, J.; Kim, Jounghoresearcher, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, pp.117 - 120, IEEE, 2001-10-29

3
Microwave frequency crosstalk model of redistribution line patterns of wafer level package

Sung, M.; Kim, N.; Lee, J.; Choi, B.; Park, I.; Hong, J.-K.; Kwon, Y.; Choi, K.S.; Kim, Jounghoresearcher, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, pp.109 - 112, IEEE, 2001-10-29

4
Microwave frequency model of water level package and increased loading effect on rambus memory module

Lee, J.; Choi, B.; Ahn, S.; Ryu, W.; Kim, J.M.; Choi, K.S.; Hong, J.-K.; Chun, H.-S.; Kim, Jounghoresearcher, 51st Electronic Components and Technology Conference, pp.128 - 132, 2001-05-29

5
Diagnosis of dental cavity and osteoporosis using terahertz transmission images

Ryu, J.; Jung, Y.; Baek, S.; Lee, J.; Kim, S.; Kwon, S.; Kim, Jounghoresearcher, International Conference on Ultrafast Phenomena (UP), v.66, pp.265 - 267, International Conference on Ultrafast Phenomena (UP), 2000-07-09

6
The improvement of Signal Integrity (SI) according to the location of via in the vicinity of a slot in the reference plane

Kim, T.H.; Lee, J.; Kim, H.; Jun, P.J.; Kim, Jounghoresearcher, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.185 - 188, IEEE, 2002-05-12

7
Slot transmission line model of interconnections crossing split power/ground plane on high-speed multi-layer board

Kim, Jounghoresearcher; Kim, H.; Jeong, Y.; Lee, J.; Kim, J., 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.23 - 26, 2002-05-12

8
Compensation of BSD and device input capacitance by using embedded inductor on PCB substrate for 3 Gbps SerDes applications

Ahn, S.; Baek, S.; Lee, J.; Kim, Jounghoresearcher, 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, v.2, pp.499 - 504, 2004-08-09

9
Reduction of multilayer PCB edge radiation excited by through-hole signal via with De-Cap Fence

Kim, Jounghoresearcher; Pak, J. S.; Lee, J., 2003 Asia-Pacific Microwave Conference, pp.870 - 873, 2003

10
Electric-field observation of pico-pulse propagation on right-angle bends by miniature photoconductive near-field probe

Lee, J.; Kim, Jounghoresearcher, IEEE MTT-S International Microwave Symposium Digest, 20002, v.3, pp.1509 - 1512, IEEE, 2002-06-02

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