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Results 1-10 of 46 (Search time: 0.003 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Radiated emission from Plasma Display Panel (PDP) depending on addressing line structure and current driving scheme

Jeong, Y.; Lee, J.; Kim, J.; Choi, S.; Kim, Jounghoresearcher; Park, H.H.; Kang, K.; Kim, H.; Whang, K., 2002 IEEE International Symposium on Electromagnetic Compatibility, v.1, pp.140 - 143, IEEE, 2002-08-19

2
Effect of ground guard fence with via and ground slot on radiated emission in multi-layer digital printed circuit board

Lee, H.; Kim, J.; Ahn, S.; Byun, J.-G.; Kang, D.-S.; Choi, C.-S.; Hwang, H.-J.; Kim, Jounghoresearcher, 2001 IEEE International Symposium on Electromagnetic Compatibility, v.1, pp.653 - 656, IEEE, 2001-08-13

3
Equivalent circuit representation and dimension reduction technique for efficient FDTD modeling of power/ground plane

Lee, H.; Kim, H.; Kim, Jounghoresearcher; Jeong, Y.C.; Kim, J., IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2001, pp.145 - 148, IEEE, 2001-10-29

4
Slot transmission line model of interconnections crossing split power/ground plane on high-speed multi-layer board

Kim, Jounghoresearcher; Kim, H.; Jeong, Y.; Lee, J.; Kim, J., 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.23 - 26, 2002-05-12

5
Design guidelines of spread spectrum clock for suppression of radiation and interference from high-speed interconnection line

Kim, J.; Jun, P.; Byun, J.-G.; Kim, Jounghoresearcher, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.189 - 192, IEEE, 2002-05-12

6
Effect of power/ground partitioning and stitching capacitor placement on signal integrity and emi of multi-layer and multi power system

Kim, Jounghoresearcher; Kim, H.; Lee, H.; Kim, J.; Kim, J., Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.59 - 62, 2001-07-08

7
Dithered timing spread spectrum clock generation for reduction of electromagnetic radiated emission from high-speed digital system

Kim, J.; Kim, Jounghoresearcher; Jun, P., 2002 IEEE International Symposium on Electromagnetic Compatibility, v.1, pp.413 - 418, 2002-08-19

8
An evaluation of differential impedance in PCBs using two single-ended probes only

Kam, D.G.; Lee, H.; Ryu, W.; Kim, J.; Park, B.; Kim, Jounghoresearcher, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.169 - 171, IEEE, 2002-05-12

9
Impact of PCB design on switching noise and EMI of synchronous DC-DC buck converter

Koo, K.; Kim, J.; Kim, M.; Kim, Jounghoresearcher, 2010 IEEE International Symposium on Electromagnetic Compatibility, EMC 2010, pp.67 - 71, IEEE, 2010-07-25

10
A compact, low-cost, and wide-band passive equalizer design using multi-layer PCB parasitics

Song, E.; Kim, J.; Kim, Jounghoresearcher; Cho, J., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.165 - 168, IEEE, 2010-10-25

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