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Results 1-10 of 35 (Search time: 0.003 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
A Compact On-interposer Passive Equalizer for Chip-to-chip High-speed Data Transmission

Kim, Heegon; Cho, Jonghyun; Kim, Joohee; Kim, Kiyeong; Choi, Sumin; Kim, Jounghoresearcher; Pak, Jun So, 21th Conference on Electrical Performance of Electronic Packaging and Systems, IEEE, 2012-10-23

2
Channel Design for Wide System Bandwidth in a TSV based 3D IC

Kim, Heegon; Cho, Jonghyun; Kim, Joohee; Kim, Myunghoi; Lee, Junho; Lee, Hyungdng; Park, Kunwo; Kim, Jounghoresearcher, 2011 Signal Propagation on Interconnects, 2011 Signal Propagation on Interconnects, 2011

3
Electrical Performance of 3D TSV Channel and 3D Stacked PDN based on Hierarchical Models

Pak, Jun So; Kim, Joohee; Cho, Jonghyun; Kim, Heegon; Kim, Jounghoresearcher, 2011 Design, Automation & Test in Europe (DATE) Conference, 2011 Design, Automation & Test in Europe (DATE) Conference, 2011-03-01

4
Frequency and Time Domain Measurement of Through-Silicon Via (TSV) Failure

Jung, Daniel H; Kim, Joohee; Kim, Heegon; Kim, Jonghoon J; Kim, Jounghoresearcher; Pak, Jun So, Conference on Electrical Performance of Electronic Packaging and Systems, IEEE, 2012-10-23

5
Basic Analysis of Signal and Power Integrity of TSV Applications

Pak, Jun So; Kim, Heegon; Cho, Jonghyun; Kim, Joohee; Kim, Kiyeong; Kim, Jounghoresearcher, 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012), 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012), 2012-05-18

6
Design of Crosstalk Compensation Passive Equalizers for High-speed Differential Signaling on 2.5D-IC Interposer

Kim, Jounghoresearcher; Choi, Sumin; Kim, Heegon; Kim, Sukjin; Jung, Daniel H; Lee, Junho; Park, Kunwoo, 2013 IEEE Electrical Design of Advanced Package & Systems Symposium , pp.253 - 256, 2013 IEEE Electrical Design of Advanced Package & Systems Symposium, 2013-12-13

7
Design and Measurement of a Compact On-interposer Passive Equalizer for Chip-to-chip High-speed Differential Signaling

Kim, Jounghoresearcher; Kim, Heegon; Cho, Jonghyun; Jung, Daniel H; Kim, Jonghoon J; Choi, Sumin; Lee, Junho; Park, Kunwoo, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.5 - 9, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15

8
Modeling and Analysis of Open Defect in Through Silicon Via (TSV) Channel

Kim, Jounghoresearcher; Jung, Daniel H; Kim, Heegon; Kim, Jonghoon J; Bae, Hyun-Cheol; Choi, Kwangseong, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.163 - 166, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15

9
Design of Contactless Wafer-level TSV Connectivity Testing Structure using Capacitive Coupling

Kim, Jounghoresearcher; Kim, Jonghoon J; Kim, Heegon; Kim, Sukjin; Bae, Bumhee; Jung, Daniel H; Kong, Sunkyu; Lee, Junho; Park, Kunwoo, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.158 - 162, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15

10
Signal Integrity Design of Bump-less Interconnection for High-speed Signaling in 2.5D and 3D IC

Kim, Jounghoresearcher; Kim, Heegon; Choi, Sumin; Kim, Dong-Hyun; Cho, Kyungjun, 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2015-05-26

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