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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Microwave Model of Anisotropic Conductive Adhesive Flip-Chip Interconnections for High Frequency Applications Kim, Joungho; Paik, Kyung-Wook; Yim, M; Ryu, W; Jeon, Y, Electronic Components and Technology Conference, Electronic Components and Technology Conference, 1999-05 | |
| An Efficient Crosstalk Parameter Extraction of Embedded Microstrip Structures on High-speed MCM Kim, Joungho; Sung, M; Ryu, W; Kim, H; Kim, J, 49th Electronic Components and Technology Conference, pp.0, 49th Electronic Components and Technology Conference, 1999-05 |
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