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Results 11-20 of 22 (Search time: 0.007 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
11
Terahertz Technology and applications

Kim, Joungho, International Meeting on Optoelectronics and Photonic Instrumentation, 1999-12

12
Picosecond Time-Domain Characterization of Millimeter-Wave Antenna Using Fiber-Coupled Photoconductive Probe Antenna

Kim, Joungho; Lee, Heeseok; Lee, Jongjoo; Kim, Woopoung; Ryu, Jaeyoung, Korea-China Joint Symposium on Semiconductor Physics and device Applications, pp.57 - 59, 1999-09-13

13
A Novel radio Frequency Clocking Scheme for Over GHz Digital Two-Phase Clock Distribution

Kim, Joungho, IMAPS Advanced Technology Workshop on Next Generation IC & Package Design, 1999-07-15

14
Donut-Shaped Head Image of Birdcage Coil Using Second Harmonic Resonance

Kim, Joungho; Pak, Jun so; Kim, Jonghoon; Park, Bu-Sik; Jung, Seung-pil; Jung, Kwan-Jin, 7th ISMRM99', pp.741 - 741, 1999-05

15
A Wide Range CMOS Adaptive Output Drivers for Customized Control of Signal Rise Time and Power/Ground Noise

Kim, Joungho, IMAPS Advanced Technology Workshop on Next Generation IC & Package Design, 1999-07

16
A New Graduate Packaging Course in Electronics Course in Electronics - High-speed Digital Interconnection and Packaging

Kim, Joungho, 2nd International Academic Conference on Packaging, 1999-03

17
Over Giga Hertz Digital Interconnects Using Anisotropic Conductive Film(ACFs)Flip-Chip

Kim, Joungho, , 1999

18
Novel time domain picosecond pulse sampling system for non-contact characterization of liquids, semiconductors, and metals

Kim, Woopoung; Ryu, Jaeyoung; Lee, Heeseok; Kim, Joungho, Proceedings of the 1999 Pacific Rim Conference on Lasers and Electro-Optcis (CLEO/PACIFIC Rim '99), v.3, pp.791 - 792, 1999-08-30

19
EMI Suppression Techniques in IC, Package and Module Designs

Kim, Joungho; Kim, Jonghoon; Kim, Hyungsoo, 2nd International Academic Conference on Packaging, 1999

20
Microwave frequency model of flip-chip interconnects using anisotropic conductive film

Ryu, Woong Hwan; Yim, Myung-Jin; Lee, Junho; Jeon, Young-Doo; Ahn, Seung Young; Yun, Young-Hwan; Ham, Seog-Heon; Lee, Yong-Hee; Paik, Kyung-Wook; Kim, Joungho, Proceedings of the 1999 International Conference on High Density Packaging and MCMs, pp.311 - 315, SPIE, 1999-04-06

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