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Results 61-70 of 526 (Search time: 0.006 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| A Wide Range CMOS Adaptive Output Drivers for Customized Control of Signal Rise Time and Power/Ground Noise Kim, Joungho, IMAPS Advanced Technology Workshop on Next Generation IC & Package Design, 1999-07 | |
| A New Graduate Packaging Course in Electronics Course in Electronics - High-speed Digital Interconnection and Packaging Kim, Joungho, 2nd International Academic Conference on Packaging, 1999-03 | |
| Circuital Approach to Evaluate Shielding Effectiveness of Rectangular Enclosures with Apertures on Multiple Sides Kim, Joungho; Shim, Jongjoo; Kam, Dong Gun; Kwon, Jong-Hwa, International Symposium on Electromagnetic Compatibility (EMC Europe), pp.295 - 300, 2004 | |
| Balanced TLM and Coupling Model for Analysis of Power/Ground Resonance, Noise Coupling, and Edge Radiation Kim, Joungho; Pak, Jun So; Lee, Jongbae; Kim, Hyungsoo; Lee, H.J; Choi, C.S, Electromagnetic Compatibility Conference, pp.505 - 508, 2004 | |
| Compensation of BSD and device input capacitance by using embedded inductor on PCB substrate for 3 Gbps SerDes applications Ahn, S.; Baek, S.; Lee, J.; Kim, Joungho, 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, v.2, pp.499 - 504, 2004-08-09 | |
| Chip-Package-Circuit Co-modeling for Analysis of Digital Power and Ground Noise Coupling Effect on CMOS Negative Feedback Operational Amplifier Kim, Joungho; Shim, Yujeong; Park, Jongbae, EMC compo, 2007 | |
| A compact, low-cost, and wide-band passive equalizer design using multi-layer PCB parasitics Song, E.; Kim, J.; Kim, Joungho; Cho, J., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.165 - 168, IEEE, 2010-10-25 | |
| TSV modeling and noise coupling in 3D IC Kim, Joungho; Cho, J.; Kim, J., 3rd Electronics System Integration Technology Conference, ESTC 2010, ESTC 2010, 2010-09-13 | |
| Analysis of power distribution network in TSV-based 3D-IC Kim, K.; Lee, W.; Kim, J.; Song, T.; Kim, J.; Pak, J.S.; Kim, Joungho; Lee, H.; Kwon, Y.; Park, K., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.177 - 180, IEEE, 2010-10-25 | |
| Reduction of multilayer PCB edge radiation excited by through-hole signal via with De-Cap Fence Kim, Joungho; Pak, J. S.; Lee, J., 2003 Asia-Pacific Microwave Conference, pp.870 - 873, 2003 |
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